In terms of appearance, FiiO FW3 continues the family-style design. It is equipped with a 10mm carbon-based dome diaphragm dynamic driver and adopts HiFi architecture – integrating independent DAC chip, professional acoustic technology, and high-end bluetooth chip to provide users with HiFi audio experience.
FiiO FW3 supports Snapdragon Sound and aptX Adaptive/LHDC bluetooth formats. The wireless transmission rate can reach 96kHz/24Bit, which can provide rich audio details. Support low-latency game mode, while ensuring HiFi sound quality, it can reduce the delay to less than 100ms. The single battery life of the earbud is up to 7 hours, and the comprehensive battery life with the charging case is up to 21 hours.
We have also teardown FiiO products before: FiiO FW5, FiiO UTWS5, FiiO EH3 NC, FiiO M3 Pro, FiiO μBTR and FiiO UTWS1. Let’s take a look at the detailed teardown report of FiiO FW3.
01/ FiiO FW3 Charging Case Teardown
Disassemble the charging case and take out the internal charging cockpit. The motherboard is fixed by screws, and the battery is fixed on the motherboard by double-sided adhesive.
There is an FPC connection indicator light on the side of the charging cockpit.
The structure on the other side of the charging cockpit.
Remove the screws, remove the battery and motherboard.
A Hall element is arranged at the end of the FPC under the main board.
Remove the main circuit on the charging cockpit.
The built-in lithium-ion battery model of the charging case: SUNDA 602328, rated capacity: 380mAh 1.4Wh, nominal voltage: 3.7V, production date: September 20, 2022. There is a QR code printed on the other side of the battery.
The battery protection board circuit is equipped with lithium battery protection and MOS tubes.
The lithium battery protection IC of silk screen Y1AH is responsible for the overcharge, overdischarge, overcurrent and other protection functions of the battery.
The silk screen 8205A MOS tube works with the lithium battery protection IC.
The circuit on the side of the motherboard of the charging case.
The circuit on the other side of the charging case motherboard.
Silkscreen Z35 1Z IC.
Screen printing 1802U overvoltage and overcurrent protection IC.
TPS SY8821 power management SoC is a chip specially designed for bluetooth headsets, which integrates a charging module and a discharging module. The charging current can be adjusted externally. The discharge module integrates two output current limiting switches, provides independent load presence detection and load insertion detection, and supports output current detection at the same time. The chip integrates NTC protection function to charge and discharge the battery more safely.
The magnetic glue power inductor, together with the power management chip, is responsible for the charge and discharge management of the battery.
Three Pogo Pin connectors for charging and communicating with the headset.
The ZIF connector that connects the FPC to the motherboard.
The four LED indicators on the FPC are used to feedback the remaining power of the charging case.
The Hall effect switch of 6207 silkscreen at the end of the FPV is used to sense the magnetic field change when the charging case is turned on/off, and then notify the charging case MCU and earbuds to pair or disconnect the connected device.
02/ FiiO FW3 Earbuds Teardown
Disassemble the earbud part, and pry open the back cover of the earbud.
There is a bluetooth antenna on the inside of the cover, and the exposed copper is connected to the motherboard.
The main board unit structure inside the cavity is fixed by positioning columns and screws. The indicator light is equipped with a black rubber cover for shading, and a white uniform paper is pasted on the top to make the light softer.
Remove the screws and take out the motherboard unit. A steel shell button battery is set under the main board, and the microphone in the earbud cavity is set in an independent cavity and connected to the main board through cables.
Disassemble the connectors and front cavity to remove the motherboard, microphone and battery.
The circuit on one side of the earbud motherboard.
The circuit on the other side of the earbud motherboard.
Connect the BTB connector of the internal component FPC.
Qualcomm QCC5141 bluetooth audio SoC is an ultra-low power single-chip solution. It adopts WLCSP package and has smaller volume. Supports Bluetooth 5.2 and Qualcomm Snapdragon Sound technology with programmable DSP, optimized for true wireless earphones.
Qualcomm QCC5141 combines high-performance audio with low power consumption, and supports 24bit/96KHz high-resolution audio. Support Qualcomm aptX audio encoding, including aptX Adaptive technology. It supports aptX Voice optimized call voice and the eighth-generation Qualcomm cVc echo cancellation and noise suppression technology. Support Qualcomm Adaptive Active Noise Cancellation (not applied on FiiO FW3), including feedforward, feedback, hybrid and adaptive, and support third-party innovation through Qualcomm extensions.
The 32.0MHz crystal oscillator provides the clock for the bluetooth chip.
The metal piece that connects the bluetooth antenna.
The silk screen 6AJI Q1J memory is used to store bluetooth configuration information.
LED indicator light, used to feedback the working status of the earbuds.
Two function keys for human-computer interaction control.
AKM AK4332 low-power DAC chip is a low-power advanced 32-bit high-quality mono audio DAC. Built-in headphone amplifier with four types of 32-bit digital filters for better sound quality, low distortion characteristics and wide dynamic range. AK4332 accepts PCM data, PDM data and DSD data. Adopt 30-Pin CSP package, small size, save space.
Silkscreen 2Y B1’s integrated lithium battery protection IC is responsible for battery charge and discharge protection.
Silk screen 38 regulator IC.
The front of the electret microphone is used for voice calls to pick up human voice.
The built-in steel shell button battery model of the earbud: CP1254AA, nominal voltage: 3.7V, capacity: 65mAh.
The internal structure of the front cavity is equipped with speakers and a motherboard for charging the earbud.
All components inside the front cavity of the earbud.
The loudspeaker is protected by a metal cover. According to the official introduction, the carbon-based spherical dome diaphragm is used, the tensile strength is about 9 times that of steel, and the mass is 1/4 lighter than that of steel. Thanks to the carbon-based material itself, FiiO FW3 can respond to high-speed transient performance in a timely manner during high-frequency response, reducing vibration segmentation and nonlinear distortion, and bringing excellent resolution and ductility that are rarely seen in TWS of the same level.
On the back of the speaker, there is a tuning hole in the middle.
After actual measurement, the size of the speaker is about 10.5mm.
FPC circuit for earbud charging.
All components of FiiO FW3 true wireless earphones.
03/ Summary
In terms of appearance design, FiiO FW3 has been sandblasted as a whole to present a metal-like texture. The earbuds continue the unique “volcanic structure” design, with excellent texture and high recognition. It is equipped with 6 pairs of balanced eartips and HS18 eartips, which can meet the wearing needs of different users and provide a comfortable wearing experience.
In terms of internal structure and configuration, the charging case has a built-in 380mAh lithium battery, and is equipped with a circuit protection board responsible for overcharging, overdischarging, overcurrent and other protection functions. On the motherboard, TPS SY8821 power management SoC is adopted, which integrates charging module and discharging module. The charging current can be adjusted externally, and the discharging module integrates two output current limiting switches and NTC protection function to charge and discharge the battery more safely.
A 10mm carbon-based dome diaphragm dynamic driver and 65mAh steel shell button battery are used inside the earbud, and an electret microphone is built into a single earbud to pick up sound. The motherboard uses Qualcomm QCC5141 bluetooth audio SoC, supports Bluetooth 5.2 and Snapdragon Sound technology, and has the characteristics of high-performance audio and low power consumption. The AKM AK4332 low-power DAC chip is also adopted to provide better sound quality, low distortion characteristics and wide dynamic range.
Source: 52audio
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