EDIFIER NeoBuds Planar is equipped with EDIFIER’s 3GEN planar driver, supports Snapdragon Sound, LDAC, LHDC 5.0 codecs, and has obtained Hi-Res Audio certification. It supports the 3GEN Qualcomm Hybrid Adaptive ANC technology, dynamically adjusts the noise cancellation intensity, and ensures that it is always in a good noise cancellation state.
Also, it supports Qualcomm aptX Voice 3-MIC calls, wearing detection, pressure-sensitive control, dual-device connection, low-latency gaming mode, wireless charging, fast charging and other functions, and can provide a maximum single battery life of about 8 hours and a comprehensive battery life of about 31 hours.
We have previously teardown the EDIFIER products including: EDIFIER Comfo Clip, EDIFIER FitFree, EDIFIER Comfo Fit II, EDIFIER Zero Clip, EDIFIER X1 Evo, EDIFIER Lolli3 ANC, EDIFIER TWS5 PRO, EDIFIER NeoBuds S, EDIFIER NeoBuds Pro, EDIFIER LolliPods Pro, EDIFIER HECATE GX07, EDIFIER HECATE GX05, EDIFIER W830NB, EDIFIER W820NB, EDIFIER HECATE G4S, etc.
01/ EDIFIER NeoBuds Planar Charging Case Teardown
Remove the cover on the inside of the box cover, and there are three magnets inside to fix it with the charging bin.
Pry open the charging case shell and take out the charging bin structure. The wireless charging receiving coil is fixed by a bracket at the bottom of the charging bin.
Remove the bracket, and set the motherboard and power input board at the bottom, which are welded with the battery and the wireless charging receiving coil wire.
Information on the label of the built-in battery in the charging case: lithium-ion rechargeable battery, model: 13300, rated capacity: 500mAh, rated energy: 1.85Wh, nominal voltage: 3.7V, charging limit voltage: 4.2V, manufacturer: CEL.
The lithium battery protection IC with silkscreen Y1AK is responsible for the battery overcharge, overdischarge, overcurrent and other protections. MOS tube with silkscreen 8205.
Remove the PCBA board. Magnets are set at the bottom of the charging bin to fix the earbuds and case lid.
The circuit on one side of the motherboard and power input board.
The circuit on the other side of the motherboard and power input board.
Function button for bluetooth pairing. 16 LED lights to provide light source for the bar indicator.
Chipsvision CV8083 wireless charging receiver chip has the characteristics of high integration, high efficiency, low power consumption, and compliance with WPC 1.2.4 protocol. It integrates efficient full synchronous rectifiers and low-dropout regulators (LDO) internally, and can implement non-contact wireless charging reception solutions with a single chip.
CV8083 has multi-time programmable (MTP) non-volatile memory to facilitate updating control firmware and device functions. The chip reserves 2 universal serial ports, both of which can realize standard two-wire communication. 6 GPIOs are reserved, providing a flexible solution for system development.
The Hall element with silkscreen AL 4V is used to sense the magnetic field changes when the earbuds enter and exit the charging case, and then notify the charging case MCU and the earbuds to pair or disconnect with the connected device.
Torch-Chip TCS9225 overvoltage and overcurrent protection chip, the chip withstands voltage above 36V.
SinhMicro SSP707 power management chip integrates 38V withstand voltage OVP, switch Charger, Boost and other functions.
SinhMicro SS888Q microcontroller, used for charging case control.
02/ EDIFIER NeoBuds Planar Earbuds Teardown
Disassemble the earbud stem cavity. The bottom of the rear cavity (right) is affixed with a bluetooth antenna, and a pressure-sensitive button is set on the side.
The front cavity is equipped with a motherboard and a battery, and the FPC is connected to the motherboard through a connector.
Remove the pressure button module.
Pressure sensor for multi-function control.
The pressure sensor FPC is connected to the BTB connector male seat of the motherboard.
Remove the motherboard, and the main control chip on the motherboard is affixed with heat dissipation copper foil.
The circuit on one side of the earbud motherboard.
The circuit on the other side of the earbud motherboard.
The BTB connector female seat connected to the FPC of the internal components of the earbud head.
Two Sunlord SDCL0603Q series multilayer ceramic inductors. This series of products achieves high Q value and high self-resonant frequency (SRF) through carefully designed coils and electrodes. It is made using a multilayer dry process and can provide high-precision and high-consistency products to meet the stringent requirements of precision electronic components.
BTB connector female socket for connecting pressure-sensitive button module.
Metal dome connected to the FPC antenna.
IC with silkscreen F241291.
IC with silkscreen UPG.
MEMS microphone of laser engraving X384M is a call microphone for voice call pickup.
CHIPSEA CSU18M68 pressure sensor detection IC is a SOC with dual-channel pressure sensing measurement function.
Metal connector connected to charging case, with rubber pads at the bottom for waterproof sealing.
IC with silkscreen M0 HH.
Qualcomm QCC5181 bluetooth audio SoC, belonging to the second-generation Qualcomm S5 audio platform, supports Bluetooth 5.4 and Snapdragon Sound, and meets the requirements for supporting LE Audio.
Qualcomm QCC5181 supports aptX audio codec technology, including aptX Adaptive and aptX Lossless, up to 24bit/96KHz. Supports aptX Voice, the eighth-generation Qualcomm cVc echo cancellation and noise suppression technology. Integrates Qualcomm adaptive ANC technology.
The crystal oscillator of the laser engraving YL320 is used to provide the clock.
The MEMS microphone of the laser carving X384M is a feedforward noise cancellation microphone, which is used to pick up external environmental noise.
Open the earbud head and remove the battery.
The model of the built-in steel shell button battery of the earbuds is: M1054X2, nominal voltage: 3.73V, rated capacity: 50mAh 0.187Wh, from MIC-POWER.
Take out the components inside the front cavity. Two magnets are set at the bottom of the front cavity to fix it with the charging case.
The speaker FPC is connected to the BTB connector male socket of the motherboard.
The front of the planar driver.
The back of the planar driver.
After actual measurement, the diameter of the planar driver is about 12.26mm.
Wearing detection sensor, which is used to realize the automatic pause playback when taking off and automatic resumption of playback after wearing.
The MEMS microphone of the laser carving X434M is a feedback noise cancellation microphone.
All components of EDIFIER NeoBuds Planar true wireless noise cancellation earphones.
03/ Summary
The charging case is equipped with a 500mAh/3.7V lithium battery and supports both wired and wireless power input. The wired mode uses the SinhMicro SSP707 power management chip, and the wireless mode is managed by the Chipsvision CV8083 wireless charging receiver chip. It also uses the SinhMicro SS888Q microcontroller.
The earphone is equipped with a 12mm planar driver, three built-in MEMS microphones for sound pickup, and a MIC-POWER 50mAh steel-shell button battery. The motherboard is equipped with Qualcomm QCC5181 bluetooth audio SoC, Sunlord SDCL0603Q series multilayer ceramic inductor and other components.
PS: Translated from 52audio
