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    Home » Teardowns » Redmi Buds 5 Pro Teardown: Use Coaxial Dual Drivers Architecture

    Redmi Buds 5 Pro Teardown: Use Coaxial Dual Drivers Architecture

    01/24/20243 Comments8 Mins Read Teardowns
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    Redmi Buds 5 Pro uses a coaxial dual-driver architecture – a dynamic woofer and a ceramic tweeter work together to provide high-resolution HiFi sound quality. It supports LHDC 5.0 transmission protocol and has obtained Hi-Res Audio Wireless certification. Supports SoundID ear canal calibration and customizes personalized tuning curves. It supports spatial audio and has three modes: standard, music, and video, bringing a full-scene 360° surround sound field experience.

    Redmi Buds 5 Pro review: 52dB ANC noise cancellation and 49ms low latency

    Through self-developed acoustic cavity structure and dual-microphone double-feed noise cancellation, it can support up to 52dB noise cancellation depth and 4000Hz noise cancellation bandwidth. They also supports 3 adaptive noise cancellation modes (depth, balance, mild) and 3 types of transparency modes (transparency mode, vocal enhancement, environment enhancement). Based on the collaboration of three microphones, namely feedforward, feedback and call, and Xiaomi’s self-developed algorithm, it can suppress 99% of daily sound sources and resist wind noise of about 9m/s.

    Supports Bluetooth 5.3 and dual device connection. The full link latency is as low as 49ms. In terms of battery life, the single playback time has been increased to 10 hours (ANF off), and the comprehensive battery life is about 38 hours. Supports fast charging function – 5 minutes of charging, you can listen to music for 2 hours.

    We have also previously teardown the Xiaomi products including: Redmi Buds 4 Pro, Redmi Buds 4, Redmi Buds 4 Lite, Xiaomi Buds 3 Pro, Xiaomi Buds 3, Xiaomi FlipBuds Pro, Xiaomi Air 2 Pro, Xiaomi Watch S1, Redmi Watch 3, Xiaomi Mi Band 7 and so on.

    • $58 – Redmi Buds 5 Pro Review


    01/ Redmi Buds 5 Pro Charging Case Teardown

    Disassemble the charging case shell and take out the internal charging bin structure.

    The front structure of the charging bin is equipped with an FPC connection indicator light and a fixed battery in the middle.

    Remove the screws and remove the motherboard.

    The Hall element structure at the end of the FPC is fixed by hot melt pillars.

    Remove all components from the charging bin.

    The circuit on one side of the charging case motherboard.

    The circuit on the other side of the charging case motherboard.

    The ZIF connector for connecting the motherboard to the FPC is from OCN, model number: OK-F302-11115.

    Function button for bluetooth pairing.

    The charging case is a metal dome connector for charging earbuds.

    SinhMicro SS888QH microcontroller. SS888X is an 8-bit low-power A/D type MCU with integrated power management function and built-in operational amplifier. SS888X has built-in Charger, 30V voltage-resistant OVP, ADC, OPA, LDO, wireless charging, UART, SPI, IIC, SSP and other rich functions and interfaces, with flexible configuration modes and different low-power options.

    With streamlined peripheral costs, excellent performance, and flexible and convenient development, SS888X provides application support for portable smart electronic devices that require charging and smart control (such as TWS charging cases, electric skateboards, handheld vacuum cleaners, etc.).

    XySemi XB5152J2SZ integrated lithium battery protection IC. The XB5152 ZR series of products is a highly integrated solution for lithium-ion/polymer battery protection, including advanced power MOSFETs, high-precision voltage detection circuits and delay circuits. Adopting an ultra-small SOT23-5 package with only two peripheral components, it is an ideal solution for limited space in the battery pack.

    Silk screen B1ACNEB0 boost IC.

    A boost inductor that works with a boost IC to boost the built-in battery and charge the earbuds.

    Silk screen H24 004 TVS tube for input overvoltage protection.

    The circuit on the FPC side.

    The circuit on the other side of the FPC.

    Three LED indicators.

    The hall element of silk screen AR3n7 is used to sense the magnetic field changes when the charging case is turned on/off, and then notify the charging case MCU and earbuds to pair or disconnect with the connected device.

    The information on the label of the built-in polymer lithium ion battery in the charging case is: model: BW50, rated capacity: 480mAh/1.82Wh, nominal voltage: 3.8V, charging limit voltage 4.35V.

    Peel off the outer label and see the silk screen information on the inner battery cell – Model: LWN 971630, from LIWINON.


    02/ Redmi Buds 5 Pro Earbuds Teardown

    Remove the earbud stem back cover. The bluetooth antenna and touch detection patch are fixed on the inside of the cover through a bracket.

    The motherboard structure inside the cavity is fixed by hot melt pillars and connected to the FPC through BTB connectors.

    Unhook the connector and take out the motherboard.

    FPC connects to the BTB connector of the motherboard, from OCN, model: OK-114GM016-35.

    The circuit on one side of the earbud motherboard.

    The circuit on the other side of the earbud motherboard.

    The MEMS microphone of Lasdiao R39S is a feed-forward noise cancellation microphone, used to pick up external environmental noise, from RAYKING.

    The BTB connector that connects the motherboard to the FPC is from OCN, model number: OK-114GF016-35.

    The metal dome to which the touch detection sensor is connected.

    A 26.000MHZ crystal oscillator is used to provide the clock.

    Metal dome for connecting bluetooth antenna.

    The silk-screened R39S MEMS microphone is a call microphone, used for voice call functions to pick up human voices, from RAYKING.

    AIROHA AB1577SA bluetooth audio SoC. AB157x is a single-chip solution supporting Bluetooth 5.3 and LE Audio, with a built-in ARM Cortex-M4F application processor for high performance and power efficiency. The embedded Tensilica HiFi Mini processor is used for the I/O peripheral control, protocol stack and DSP processing functions of the AB157x.

    AB157x integrates audio codecs, hybrid ANC, next-generation echo cancellation and ultra-wideband AIsmartnoise cancellation solutions. Supports the new generation of ambient sound. It also supports the latest LE Audio and Auracast broadcast audio, enabling richer bluetooth use cases. In addition, with the help of AIROHA/MTK bluetooth high data rate technology, AB1577 can transmit lossless audio to enhance audio quality and music listening effect.

    Silk screen eh CH’s IC.

    Silk screen HX9031A touch detection IC.

    Disassemble the earbud head cavity.

    The internal structure of the front cavity secures the battery with brackets and glue.

    The integrated lithium battery protection IC of 3m nz is silk-printed on the battery FPC.

    Disconnect the solder joints and remove the battery.

    The earbud has a built-in steel shell button battery, model: M1154S3, rated voltage: 3.85V, capacity: 54mAh 0.208Wh, from MIC-POWER.

    Take out the stand and speaker.

    In the internal structure of the front cavity, the end of the FPC is equipped with an in-ear detection sensor and a feedback noise cancellation microphone. Capacitive in-ear detection sensor is used to automatically pause music playback when taking off the earbuds and automatically resume playback when wearing them.

    Take out the FPC inside the front cavity.

    The customized coaxial dual drivers, the upper layer uses a 10mm piezoelectric ceramic tweeter, which is responsive and the treble is delicate and purer. The lower layer is an 11mm titanium-plated woofer (dynamic driver), which has strong bass and natural and open sound.

    After actual measurement, the diameter of the dynamic driver is about 11mm.

    The MEMS microphone of Lasdiao R3A6 is a feedback noise cancellation microphone, used to pick up noise from inside the ear canal, from RAYKING.

    All components of Xiaomi Redmi Buds 5 Pro true wireless noise cancellation earphones.


    03/ Summary

    Redmi Buds 5 Pro continues the design of the previous model in terms of appearance. The charging case is small in size, has a metal-like matte coating and has excellent texture. The in-ear earbuds are smooth and rounded, and equipped with skin-friendly silicone eartips, which can provide a comfortable and stable wearing experience. The back of the earbud stem is processed through three different processes, making it rich in layers and highly recognizable.

    The charging case has a built-in 480mAh lithium battery, and the battery cells are from LIWINON. The motherboard is equipped with the SinhMicro SS888QH microcontroller, which has rich built-in functions and interfaces, flexible configuration modes and different low-power options. It adopts XySemi XB5152J2SZ integrated lithium battery protection IC, which is a highly integrated solution for lithium ion/polymer battery protection.

    The earbuds have a built-in custom coaxial dual driver of an 11mm titanium-plated woofer and a 10mm piezoelectric ceramic tweeter. Three RAYKING MEMS microphones. Built-in MIC-POWER 54mAh steel case button battery. The main control chip is AIROHA AB1577SA bluetooth audio SoC, which integrates hybrid ANC, new generation echo cancellation and ultra-wideband AI smart noise cancellation functions.

    PS: Translated from 52audio


    Check Xiaomi Redmi Buds 5 Pro price:

    • Check latest price on AliExpress
    • Check latest price on Amazon US
    • Check latest price on other Amazon countries
    • Check latest price on Banggood
    Redmi true wireless earphones tws tws earbuds wireless earbuds xiaomi
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    3 Comments

    1. Federico on 02/11/2024 1:30 PM

      will you do a teardown of the redmi buds 5?

      Reply
      • Qucox on 02/11/2024 9:08 PM

        There are no plans for this at the moment.

        Reply
    2. Leandro on 09/11/2024 8:42 AM

      Good morning! how can I dismantle the lid and inside of the Buds 5 Pro Xiaomi? I couldn’t take the lid off by the tutorial.

      Reply
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