Philips was founded in 1891, and has been deeply involved in the audio field since the brand was founded. The current headset products cover all types of true wireless earphones, head-mounted headphones, neck-mounted headphones, bone conduction headphones, noise cancelling headphones, esports headphones, etc.
Fidelio is a high-end series launched by Philips in 2011, including four series of X, L, M and S. A number of head-mounted wired headphone products have been launched before. PHILIPS Fidelio L3 went on the market this year, using a wireless solution for the first time.
Philips Fidelio L3 over-ear noise cancelling headphones continues the family-style design language in appearance, but has changed a lot from the previous generation. The overall appearance tends to be more toward the previously dismantled 9000 series head-mounted noise cancelling headphones. In terms of functions, it is equipped with a flagship configuration, adopts a dual-core + dual-fed noise cancelling communication solution, and an independent noise cancelling chip with ANC hybrid technology, which brings excellent noise cancelling effects. Qualcomm bluetooth chip provides stable and efficient wireless connection and transmission.
In terms of acoustic configuration, it has a built-in 40mm neodymium driver unit, with Fidelio logo tuning, and a frequency response range of up to 40KHz (when connected to the headphone cable). Qualcomm QCC3034 bluetooth chip supports aptX HD high-definition audio decoding and has obtained Hi-Res AUDIO certification. Other aspects also support functions such as smart touch, wear sensing, smart hands-free dialogue, and multi-point connections. It supports fast charging and has a battery life of 38 hours (ANC off)/32 hours (ANC on).
Before 52audio teardown – PHILIPS TAH9505, Philips TAT2205, Philips SHB4385 and Philips TAT1285. Let’s take a look at the detailed teardown report of this product.
01/ PHILIPS Fidelio L3 headphones teardown
After unpacking, we learned about the overall design of this product, as well as the location of the function buttons and interfaces. Let’s enter the teardown part with this, and take a look at the internal structure configuration information.
First, disassemble the left earphone and remove the clip-on earmuffs.
The inner structure of the earmuff is provided with an annular sealing ring.
The earphone sound cavity cover structure, the middle sound hole position adopts an inclined design, which is more in line with the structure of the human ear, and can better transmit sound to the ear canal. A more dense dust-proof net is also installed to prevent foreign objects from entering the sound cavity.
Tuning hole on the cover.
Remove the screw to remove the speaker unit. The internal structure of the cavity is provided with a battery unit and a small power input board.
The back of the speaker is fixed by screws, and the cable through hole is connected to the left ear adapter board.
The speaker cable is sealed with glue at the opening, and the end is connected with a ZIF connector.
The tuning hole on the sound cavity cover ensures air circulation inside the sound cavity.
Remove the screw to open the sound cavity.
Rubber gaskets are arranged in the joint grooves of the cover structure.
On the back of the speaker, a layer of damping paper is attached to adjust the damping of the speaker, and the silk screen is printed with “B217H”.
Take out the speaker, a noise cancelling microphone is installed at the end of the cable to pick up the noise inside the ear canal.
The internal structure of the left earphone cavity, the battery and the power input board are connected to the adapter board, and then input to the right earphone through a wire.
The battery wire is connected to the adapter board through the socket.
One end of the adapter board is connected to the power input small board through a ZIF connector.
There is a noise cancelling microphone at the other end.
Laser carving F000 0597’s MEMS noise cancelling microphone is used for the active noise cancelling function to pick up external environmental noise.
Take out the power input board, the front circuit.
Power input circuit on the back of the small board.
Type-C power input interface female socket.
Power button.
Connect the ZIF connector of the adapter board.
Willsemi ESD56241D24 18V TVS protection tube, used for input overvoltage protection.
A one-piece inductor is used to step down and charge the battery.
Silergy SY6913C is a high-efficiency two-way power pack regulator for single battery pack power supply. It is a 5V adapter input and a two-way regulator with up to 18V surge. It is designed for single-cell lithium-ion battery power pack applications. It adopts advanced two-way energy flow control and has automatic input power detection function to realize the alternation of battery charging mode and battery power supply mode. It also integrates discharge/disable control and LED status indication.
SGM SGM2521 programmable current-limiting switch is an electronic fuse with compact structure design, rich functions and a full set of protection functions. TDFN-2×3-8BL package.
A sponge cushion cushion is provided at the junction between the back of the battery unit and the shell.
The battery wires are connected by sockets.
The headphone has a built-in lithium-ion soft pack battery, model: 683139PN2, rated capacity: 800mAh/2.96Wh, nominal voltage: 3.7V, charging limit voltage: 4.2V, from Chongqing VDL Electronics Co., Ltd., production date: 21 years 7 On the 12th.
The battery is equipped with a circuit protection board.
8205A MOS tube, used to control battery output.
Lithium battery protection IC of silk screen Y1AA.
Teardown the right earphone part and remove the earmuffs.
The inner structure of the earmuffs.
The right earphone has the same structure as the left earphone, but the difference is that an infrared sensor unit is provided.
Infrared sensor optical structure.
Remove the screws and open the cavity. The speakers, microphones, and infrared sensors inside the sound cavity are connected to a cable, and then connected to the motherboard through the ZIF connector.
Open the connector and separate the sound cavity structure.
Open the sound cavity of the right earphone, the internal structure.
Take out the loudspeaker, and set the feedback noise cancelling microphone and infrared sensor at the end of the cable.
Infrared sensor, used for wearing sensing function.
Laser carving S1AV 1413 3030 MEMS noise cancelling microphone is used to pick up the internal noise of the ear canal.
The front of the speaker.
The size of the speaker is compared with the RMB coin.
After actual measurement, the overall size of the speaker and the outer protective ring is about 41mm.
The internal structure of the right earphone cavity is provided with a main board, an audio input small board and a touch pad, all of which are connected through a ZIF connector.
The audio input board is fixed in a separate groove by screws.
Dozens of wires extending from the left earphone are soldered on the motherboard, and metal buckles are provided at the wire through holes to prevent the wires from moving.
Heat and solder off the wire solder joints, take out the main board, the internal structure of the cavity, and a touch detection patch at the bottom.
Earphone bluetooth antenna, silk screen message “QWE43 V5” is connected to the motherboard through metal contacts.
The side talk microphone is fixed with a lot of glue.
Laser carving F11R 0750 MEMS microphone is used for voice call pickup.
A call microphone is also provided on the other side of the cavity.
It is also the call microphone of the laser carving F11R 0750. The two call microphones work together to intelligently control the echo and environmental noise to provide a clear call effect.
The right earphone feed-forward noise cancelling microphone is also fixed with a lot of glue.
Laser carving F000 0597 MEMS noise cancelling microphone is used to pick up external environmental noise.
Take out the small audio input board, inside the two function button keycaps.
Audio input circuit on the side of the small board.
Audio input circuit on the other side of the small board.
2.5mm audio input interface female socket.
Headphone indicator light guide structure.
Voice assistant wake up button.
Noise cancelling mode switch button.
Two LED indicators of different colors are used to feed back the working status of the headphone.
There are multiple ZIF connectors on the edge of the circuit on the front of the motherboard to connect to other components.
The circuit on the back of the motherboard.
Two pogo pin connectors for connecting the bluetooth antenna.
QUALCOMM QCC3034 bluetooth audio SoC. Adopted in VFBGA package, it is a bluetooth audio SoC based on ultra-low power consumption architecture. It uses a three-core processor architecture and consists of two 32-bit processor application subsystems and a Qualcomm Kalimba DSP audio subsystem. Support Qualcomm aptX™ and aptX HD audio coding, Qualcomm cVc noise cancellation technology, Qualcomm TrueWireless™ stereo and other functions.
According to 52audio, there are already many TWS true wireless headphones. Audio products such as head-mounted, neck-mounted bluetooth headphones, smart speakers, and smart audio glasses use Qualcomm bluetooth Audio SoC.
The 32.000MHZ crystal oscillator provides the clock for the bluetooth chip.
A filter inductor.
MXIC MX25U6435F memory, used to store information such as bluetooth configuration.
The SONY CXD3782GF ultra-low power active noise cancelling solution uses hybrid noise cancelling technology, has a feedforward/feedback independent multi-stage filter configuration, and integrates a 6-band audio line equalizer path.
The crystal oscillator that provides the clock for the noise cancelling chip.
The voltage regulator IC of silk screen 12.
The IC of silk screen 01.
Silk-screen HE IC.
The touch detection IC of the silk screen ES6620 works with the touch patch on the cover to realize the touch operation function.
Silkscreen OZKI’s IC.
The IC of silk screen IO.
All components of PHILIPS Fidelio L3 over-ear noise cancelling headphones.
02/ Summary
Philips Fidelio L3 over-ear noise cancelling headphones adopts a simple and stylish design in appearance, with an integrated head beam, ear shell, and connection ring. The three-stage structure is simple and neat, and it is recognizable. The soft and skin-friendly leather earmuffs provide a comfortable and breathable wearing experience, and the snap-on fixing is also easy to disassemble for replacement or cleaning. The head beam supports flat folding and size adjustment, providing portability and a personalized wearing experience.
In terms of internal structure configuration, a 40mm neodymium drive unit is used. The left earphone is equipped with a small battery and power input board, as well as a front and rear noise cancelling microphone. The built-in battery capacity is 800mAh, from VDL. Using Type-C interface input power, equipped with Willsemi ESD56241D24 18V TVS protection tube, SILERGY SY6913C two-way power group regulator, SGMICRO SGM2521 programmable current limit switch, etc.
The Philips Fidelio L3 right earphone is equipped with a motherboard, an audio input panel, a touchpad, an infrared sensor and 4 microphones for noise cancelling and voice calls. The components are all connected by ZiF connectors, which improves the convenience of assembly. On the motherboard, the main control chip is Qualcomm QCC3034 bluetooth audio SoC, which supports bluetooth 5.1, Qualcomm aptX HD audio decoding, and dual-microphone call noise cancelling technology. Sony CXD3782GF ultra-low power active noise cancelling solution, with feedforward/feedback independent multi-stage filter configuration and MXIC MX25U6435F memory, etc.
Source: 52audio
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2 Comments
How did you get the ear cups off? For the life of me I can’t figure out how to remove them. I want to find a way to replace the ear pads with something larger because the stock ones are just too small for me, unfortunately.
Did you figgure it out? Im as stuck as you ..