After grabbing the market share of smart speakers, on April 9, 2021, 4 years after the last Xiaomi AI speaker, Xiaomi released the second generation of Xiaomi AI speaker. Compared with the previous product, this iteration of smart speakers has been optimized and upgraded in other aspects while retaining the original design.
Compared with the previous generation products, Xiaomi AI Speaker 2 has improved sound quality. Upgrade the chip to bring a better IoT experience. The official said that there are currently more than 271 million smart devices connected, and the devices can also be connected using the MiJai app, bringing more convenience to users to experience smart homes.
In this upgrade, Xiaomi AI speaker 2 has a built-in bluetooth Mesh gateway, which can easily realize the networking of bluetooth products at home, and it also supports multiple devices to play stereo and whole house playback. In addition, the device also supports coordinated wake-up to avoid the situation of one-stop response. The voiceprint can be used across speakers, eliminating the need to repeat the complicated registration process. At the same time, Xiaomi Eco can automatically synchronize the user’s music software playlists and collections, and cooperate with multiple streaming media platforms to truly simplify the operation process with voice.
52audio previous dismantling of Xiaomi products include: Xiaomi 3 Pro, Xiaomi Xiaoai Speaker Play Enhanced Edition, Xiaomi FlipBuds Pro, Xiaomi Air 2 Pro, Xiaomi Air2 SE, Xiaomi Air 2S, Xiaomi Air 2, Redmi AirDots 3 Pro, Redmi AirDots 3, Redmi AirDots 2, Redmi AirDots true wireless bluetooth earbuds, etc. Let’s take a look at the Xiaomi AI speaker 2 after the iteration.
| Xiaomi AI Speaker 2 teardown
First remove the non-slip foot pads, remove the screws, and open the cover at the bottom of the cavity.
Disassembly diagram of the box body and bottom cover.
Four non-slip foot pads.
Inside the bottom cover of the speaker, there is a sponge pad around the inside of the cover for sealing the speaker.
Looking at the inside from the bottom of the speaker, you can see the sound guide cone and the power input cable.
The speaker body and shell are removed.
The audio components are connected through sockets, and the wires are wrapped with foam materials to avoid vibration and abnormal noise. A capacitor pad is reserved between the two sockets.
The bottom of the speaker is equipped with a sound guide cone structure to facilitate sound diffusion.
Sound guide cone.
The speaker unit located above the sound guide cone.
The speaker’s inverted hole is used to enhance the low-frequency volume.
The shockproof sponge pad between the horn and the cavity is used to seal the unit and the cavity.
The upper cover of the sound box is connected to the cavity and fastened by four screws on the left and right sides.
The internal cavity is affixed with sponge rubber buffer.
The bottom structure of the upper cover of the speaker.
The upper cover of the sound box is separated from the shell. Use white foam to seal between the top cover and the shell.
The upper cover is disassembled and printed with the product model: MDZ-25-DA; Material: PC.
The back circuit board of the upper cover is printed with the Xiaomi logo, which is highly integrated.
Laser carving G051 1A17 MEMS microphones, a total of six, are used for far-field sound pickup.
There are 12 RGB LED indicators, which are used for light effect display.
ISSI 3236A 36-channel LED driver. Consists of 36 constant current channels, each channel has an independent PWM control, used to drive the LED digital tube.
TI MSP430 capacitive touch sensing mixed-signal microcontroller, with 16 touch IO (24 sensors), 16KB FRAM, 2KB SRAM, 19 IO, 10-bit ADC capacitive touch MCU. Provides the most integrated and autonomous capacitive touch solution on the market, with high reliability, noise immunity and lowest power consumption. TI’s capacitive touch technology supports the use of both self-capacitance and mutual-capacitance electrodes in the same design, maximizing flexibility.
The circuit board next to the cavity unit is printed with the Xiaomi Logo, and the important components are shielded. The workmanship is fine, the integration is high, and the component arrangement is reasonable.
Copper exposed through holes corresponding to the chip position on the back of the circuit board for heat dissipation.
Reserved MICRO USB interface.
Printed WiFi antenna on board.
Onboard printed bluetooth antenna.
The electrolytic capacitor is glued and reinforced.
Two step-down ICs with silk screen “JWK8J 1GD2E” from Jiehuate.
The step-down IC with “JWH6J 0dB3J” silk-screened by Jiehuat.
TI TPA3138D2 Class D stereo audio amplifier IC supports a voltage operating range of 3.5V to 14.4V. With mono output, the idle current is only 20mA (12V) in 1SPW mode, which is suitable for portable products.
Silk screen “JWF5J 1BC1R” IC
X-power AC107 has a 103dB dynamic range, high-performance, low-power dual-channel ADC chip.
IC with silk screen “JWLCD ORA1C”
The voltage regulator chip of silk screen 9A.
Toshiba TC58BVG0S3HTA00 NAND Flash, 128MB capacity, used to store firmware information.
Below the shield is the Realtek integrated WIFI bluetooth chip.
Realtek RTL8733BS WiFi and bluetooth Combo single chip solution, WiFi specification 802.11abgn dual-band 1T1R and bluetooth 5.2, is a WiFi4 Combo network card.
Dual-band capability, 2.4G channel is responsible for the opening of BT Mesh bluetooth networking, such as bluetooth buttons, doorbells and other smart equipment. The 5G WiFi crossover is responsible for providing stable high-speed data transmission WiFi, enjoy high-speed networking and the reception of lossless sound quality music.
In bluetooth 5.2, LE Isochronous Channel, commonly known as LE Audio, can provide multi-channel simultaneous transmission to achieve low-latency stereo and home theater audio modes.
According to 52audio, there are already many well-known brands such as BULL Bull, AUKEY, RAPOO, Anker, Haylou, Amazon, Anker, Astrotec, FIIL, JLab, Xiaomi, Redmi, QCY, Toshiba, UGREEN and many other well-known brands that use Realtek chips.
Allwiner R329-S3 AI voice chip under the shield.
Allwiner R329 voice dedicated chip, built-in dual-core A53 1.5GHz, 28nm process, with dedicated AI voice computing unit: Zhouyi AIOU, HiFi4 DSP two computing units, providing highly integrated application solutions for smart speakers.
According to 52audio, many well-known brands such as Baidu, JD, Xiaomi, Meizu, Sony, Tmall, and Tencent have adopted Allwinner chips in their products.
All components of Xiaomi AI speaker 2.
Xiaomi AI Speaker 2 retains the simple design of the previous generation in appearance. It also uses a rectangular parallelepiped shape, and the sound hole of the fuselage is inverted. Increase the quality of high frequency and low frequency, with the internal sound guide cone structure, to achieve a 360° deep sound effect. The bottom charging hole is changed to a DC power port, and the charging port position is transferred to the inside of the bottom rubber anti-skid pad, which is safer.
The internal structure configuration is mainly divided into the design of the top main board, the middle cavity, the bottom sound guide cone and the DC power input interface.
There is an IS31FL3236A LED driver on the top board, which provides brilliant colors. Equipped with 6 laser carving “G051 1A17” MEMS microphones to form a 360° pickup array, which effectively improves pickup efficiency. TI MSP430 capacitive touch sensing mixed-signal microcontroller is a very flexible chip on the market.
On the cavity motherboard, the single-chip solution of RTL8733BS WiFi bluetooth Combo, dual-band capability can provide stable WiFi throughput in a relatively clean 5G frequency band, provide fast networking and lossless high-quality sound quality music transmission. TI TPA3138D2 Class D stereo audio amplifier IC supports a voltage operating range of 3.5V to 14.4V. With mono output, the idle current is only 20mA (12V) in 1SPW mode, which is suitable for portable products. Allwiner R329 voice dedicated chip, built-in dual-core A53 1.5GHz, with dedicated AI voice computing unit: Zhouyi AIOU, HiFi4 DSP two computing units, providing highly integrated application solutions for smart speakers. And Toshiba TC58BVG1S3HTA00 memory for storing files.