Sony INZONE H9 wireless noise canceling gaming headset is equipped with a 40mm high-fidelity diaphragm dynamic driver and a symmetrical structure design. Support rhythm response control, provide surging low frequency effect. Support 10-level equalizer custom adjustment, providing a personalized listening experience. Support 360 game spatial sound effects, based on Sony spatial audio technology and real human ear HRTF database, provide 7.1-channel virtual surround sound. Supports game/chat mode switching, which can highlight game sound effects or teammate communication sounds according to needs.
Sony INZONE H9 is also equipped with the same noise canceling technology as the 1000X series. Support ANC function, which can provide an immersive gaming experience without external interference. It support 20 levels of adjustable ambient sound, and you can easily get external sounds by wearing headphones. In terms of wireless connection, it support 2.4G receiver and bluetooth, and support multi-point connection. It supports fast charging and charging, and the single battery life can reach about 32 hours.
Sony products we have previously teardown include: Sony LinkBuds S, Sony LinkBuds, Sony WF-1000XM4, Sony WF-XB700, Sony WF-H800, Sony WF-SP900, Sony XPERIA Ear Duo, Sony HT-S40R and Sony SRS- XB13. Let’s take a look at the detailed teardown report of this product.
01/ USB wireless transceiver teardown
Remove the switch button keycap on the USB wireless receiver.
Pull out the inner structure of the shell.
On one side of the internal structure of the USB wireless receiver, the motherboard is fixed by a bracket.
The indicator light guide bar at the bottom.
Open the bracket and take out the motherboard.
The overall structure of the light guide column inside the bracket also has the function of buttons.
One side circuit of the USB wireless receiver motherboard.
The circuit on the other side of the motherboard.
PCB printed antenna for wireless signal transmission.
LED indicator light, used to feedback the working status of the wireless receiver.
The pairing switch, PC and PS5 switch button on the motherboard.
Screen printing L18 AD regulator IC.
Silkscreen 6041 1C98 IC.
Silk screen WG TVS tube for input overvoltage protection.
Screen printing L12 AK regulator IC.
NXP NxH3670 low-latency, ultra-low-power wireless gaming headset solution. It is a highly integrated single-chip ultra-low power consumption 2.4GHz wireless transceiver with embedded MCU for wireless audio streaming, suitable for ultra-low latency gaming headsets.
Running a proprietary audio streaming protocol, the NxH3670 has been optimized for gaming headset applications, providing high-quality, low-latency (<20ms) front-facing audio streaming as well as voice-mic back-channel. In addition, a wireless data channel is provided.
NXP M27P8V microcontroller, which belongs to the Kinetis KL27 series. The Kinetis KL27 series is an ultra-low power 32-bit MCU based on the ARM® Cortex®-M0+ processor with a core operating frequency of 48MHz. Integrated 128/256KB flash memory, 32KB SRAM and 16KB ROM. Integrates peripherals such as USB FS 2.0, UART, I²C and 16-bit SPI.
The Kinetis KL27 family is optimized for cost-sensitive and battery-powered applications requiring low-power USB connectivity. Down to 54uA/MHz in very low power run mode and 1.96uA in deep sleep mode (RAM + RTC reserved).
02/ Sony INZONE H9 headset teardown
Enter the headset teardown section. Remove the snap-on ear cups.
The inner structure of the earmuffs, the decompression leather is fixed by the positioning column.
Right headphone cavity cover plate structure. The middle wire is connected to the noise canceling microphone, and the rubber cover is sealed to improve the radio performance.
Feedback noise canceling microphone for picking up ambient noise from inside the ear canal.
The pickup hole on the other side of the feed-back noise canceling microphone is protected by a sponge pad.
The cover plate of the left headphone cavity has the same structure as the right headphone.
After actual measurement, the size of the speaker is about 40.67mm.
Tuning holes on the cavity cover for improved audio performance.
Open the internal structure of the right headphone cavity.
The cavity is made of ABS material.
The sound guide tube on the side of the cavity is protected by tuning cotton, which is used to adjust the air pressure balance inside and outside the headphone cavity and optimize the low-frequency performance.
The internal structure of the cavity is provided with a battery and a PCB main board.
The battery lead is connected to the motherboard through a socket.
Take out the battery from the cockpit, and fix the battery with double-sided tape. The built-in rechargeable lithium-ion battery pack model of the headphone: 702428, charging limit voltage: 4.4V, rated capacity: 520mAh/2.0Wh, nominal voltage: 3.85V, from Springpower Technology (Shenzhen) Co., Ltd., made in China.
The silkscreen information on the battery cell is consistent with the information on the external label.
The battery is equipped with a circuit protection board, equipped with a lithium battery protection IC and MOS tube, and a thermistor for detecting the temperature of the battery.
Feed-forward noise canceling microphone on the cavity wall.
The main board of the ring indicator light is fixed by a plastic cover.
The main board structure of the indicator light is welded by wires.
Ring indicator light guide bar.
The main board circuit of the indicator light is equipped with three RGB LED lamp beads, which support 13 kinds of color adjustment.
One side circuit of the motherboard inside the right headphone.
The circuits on the other side of the motherboard.
The function buttons on the main board and the four micro switches adopt the same specifications. The position where each micro switch is in contact with the cover plate is pasted with a buffer sponge.
Open the internal structure of the left headphone cavity.
The internal structure of the cavity includes the headphone main board and the power input main board.
The indicator light guide bar on the power input main board.
The power input circuit on one side of the motherboard.
The power input circuit on the other side of the motherboard.
Resettable fuse with silk screen M.
Volume adjustment encoder, laser engraved model “148N” brand from ALPS.
LED indicator for feedback charging status.
The internal rotating structure of the suspension microphone, and the metal sheet are used to provide a sense of passage for the feedback of the rotating microphone.
The rotating structure corresponds to the microswitch on the main board, and when the microphone is rotated to the mouth, the microphone is turned on to collect sound.
The microphone rotation structure under the motherboard.
The circuits on one side of the motherboard.
The circuits on the other side of the motherboard.
2.4G antenna on the motherboard.
Silkscreen IC of WLC 335.
Silkscreen BXJ N38 IC.
MEDIATEK MT2811BA bluetooth audio SoC. The MT2811 platform solution is equipped with MCSync TWS dual-issue bluetooth transmission mechanism, which supports the seamless connection experience of master-slave exchange. Support Bluetooth 5.0, Ultra low power, Google Bisto voice assistant and other functions.
The headset is equipped with an NXP NxH3670 ultra-low-power 2.4 GHz wireless transceiver for wireless connection with a USB wireless receiver to achieve ultra-low-latency wireless transmission.
Silkscreen L16A IC.
SONY CXD3782GF ultra-low power active noise canceling solution. It adopts hybrid noise canceling technology, has feed-forward/feedback independent multi-stage filter configuration, and integrates 6-band audio line equalizer path.
The RGB LED driver is from ROHM, model BD2812GU, which is used to drive two-way RGB LED indicators. The chip has a built-in charge pump, which is controlled by the I2C bus and supports overheating protection.
Cirrus-Logic CS47L35 Smart Codec with Low-Power Audio Digital Signal Processor (DSP) for Smartphones, Tablets, and Other Portable Audio Devices.
CS47L35 has a 450 MIPS architecture triple-core audio signal processor with high-performance 4/3-channel, 24-bit high-fidelity codec embedded with SoundClear software technology. Multiple concurrent audio features are supported, including multi-microphone wideband noise cancellation, speaker protection, acoustic echo cancellation (AEC), low-power single/multiple trigger utterance detection and engine support, and advanced speech and media enhancements.
The NXP M27P8V microcontroller inside the headset.
MXIC MX25U3232F 1.8V 32M serial NOR flash memory for storing system firmware.
The internal structure after opening the external microphone.
The inner structure of the microphone pickup hole is protected by a fine dust-proof net.
Electret microphone, used for voice call function pickup.
All components of the Sony INZONE H9 over-ear wireless noise canceling gaming headphones.
Sony INZONE H9 is very distinctive in appearance design, the same black and white as the PS5 series. The headset shell adopts a unique oval design that conforms to the shape of the human hand, and is equipped with a hanging freely adjustable microphone. Supports 13 colors of ring-shaped LED indicators to create a more immersive gaming atmosphere for users. The thick and comfortable head cushion, soft and pressure-reducing leather earmuffs, and the rotatable/telescopically adjustable head beam provide a comfortable and personalized wearing experience.
In terms of internal structure and configuration, the left and right headphones are equipped with a 40mm dynamic driver and feed-forward + feed-back noise canceling microphones. In other respects, the right headphone has a built-in 3.85V 520mAh lithium-ion battery, and is equipped with a circuit protection board for charge and discharge protection. The left headphone has a built-in motherboard and is equipped with a MEDIATEK MT2811BA bluetooth audio SoC for bluetooth mode connection. Adopt NXP NxH3670 ultra-low power 2.4 GHz wireless transceiver for low-latency wireless transmission with USB wireless receiver.
It also adopts SONY CXD3782GF ultra-low power ANC solution and supports hybrid noise canceling technology. Cirrus-Logic CS47L35 Smart Codec with Low Power Audio Digital Signal Processor (DSP). NXP M27P8V microcontroller. MXIC MX25U3232F 1.8V 32M serial NOR flash memory and RGB LED driver etc. USB Wireless Transceiver Inside the motherboard is the NXP NxH3670 2.4GHz wireless transceiver and NXP M27P8V microcontroller for connecting to the headset.
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