Samsung released the flagship TWS headset product Galaxy Buds Pro in early 2021. As a summary of the previous generations, both hardware and software functions have been greatly updated. In August, Samsung launched the Galaxy Buds 2 product again at the autumn conference. The appearance returned to the colorful and colorful colors of the first generation of products, and it was more youthful. Compared with the Galaxy Buds Pro in terms of function, there are both improvements and reductions.
The biggest feature of the Samsung Galaxy Buds 2 true wireless earphones this time is a new attempt in color matching. It adopts a two-color splicing design inside and outside. All charging case shells are white. Open the lid to see the real olive and graphite. , Lavender and white. The earphones are still bean-shaped in-ear, with a natural design and a smooth and rounded body.
Galaxy Buds2 true wireless headsets also choose a dual-unit combination to support active noise reduction/ambient sound mode. Support voice detection function, through the built-in VPU voice pickup unit, intelligently recognize the user’s voice, and automatically turn on the ambient sound mode. The headset is equipped with three microphone sets, with AI algorithm and wind-proof structure to improve the quality of voice calls. It also supports fast charging and wireless charging.
52audio has teardown Samsung headphones including: Samsung Galaxy Buds Pro, Samsung Galaxy Buds Live, Samsung Galaxy Buds+, Samsung Galaxy Buds, Samsung Gear IconX 2018 and Samsung Gear IconX. Let’s take a look at the detailed dismantling report of this product.
|1. Samsung Galaxy Buds2 Charging case teardown
After unpacking, we have a detailed understanding of the overall design of Samsung Galaxy Buds2. The internal precision and orderly, highly integrated and modular structure design of Samsung products is what we are more looking forward to. Let’s enter the dismantling part below to see if this product continues the features of previous generations of products.
Pry open the charging cockpit, the internal structure is more concise than the previous generation.
There is no cable set on the back of the cockpit, and the black bracket is fixed by screws.
There is a magnet under the bracket, which is only used to absorb the earphone and charging case cover. The frame groove is the position of the board.
The internal structure of the charging case cavity, all components are fixed on the internal bracket, the bracket is fixed with the shell by screws.
The pogo pin board for charging the headset is connected to the motherboard through the BTB connector.
Remove the battery module. This time the battery module adopts a semi-enclosed structure, without a cover plate on the front.
The back structure of the battery module is provided with three positioning posts.
The positive and negative poles of the battery are connected to the main board with metal contacts.
Lithium-ion soft pack battery external label information, model: EB-BR190ABY, nominal voltage: 3.85V⎓, charging limit voltage: 4.4V⎓, rated capacity: 472mAh/1.81Wh.
The silkscreen information on the battery cell is consistent with the external label, which comes from ATL.
The battery is equipped with a circuit protection board, and there is an integrated lithium battery protection IC on the protection board, which is responsible for the overcharge, overdischarge and overcurrent protection of the battery.
The internal structure of the cavity after taking out the battery module.
The Type-C charging interface female seat is provided with a metal protective cover, which is reinforced by screws, and also plays a role in fixing the motherboard.
The charging case cover connection structure.
Remove the main configuration in the charging case, and use metal nuts for the screw holes on the casing of the charging case.
Indicator light guide.
The main circuit in the charging case includes two PCB boards and a wireless charging receiving coil.
The small board for the main board to charge the headset is fixed on the front of the bracket.
On the back is the wireless charging receiver coil, silk screen number: AM0-210714.
A small board circuit for charging the headset.
Charging case battery indicator at the end.
Headphone LED indicator.
The Hall element of the silk screen KZ1UC is used to detect the magnetic field changes when the charging case lid is opened and closed, and then inform the charging case MCU and the headset to pair or disconnect with the connected device.
Pogo Pin connector for charging the headset.
The charging case front circuit of the motherboard.
The circuit on the back of the motherboard.
Type-C charging interface female socket laser engraving model J1602.
A silk-screen HJLHF input protection chip is installed at the Type-C interface.
Two metal dome are connected to the positive and negative contacts of the battery.
The charging case main control chip is the integrated power management chip MUA01 independently developed by Samsung. This is the industry’s first solution to support wireless and wired charging in a single chip, and the peripheral circuit is very streamlined. Previously, it has been applied on Samsung Galaxy Buds Pro true wireless noise-cancelling headphones, Galaxy Buds Live true wireless noise-cancelling headphones and Galaxy Buds+ true wireless bluetooth headsets.
Samsung MUA01 supports the Qi 1.2.4 wireless charging standard of the Wireless Power Consortium (WPC). In order to provide effective power management, MUA01 integrates an efficient switching charger. MUA01 also has a built-in MCU and embedded flash memory (eFlash), which can upgrade the firmware in the air, reduce the use of peripheral components, and reduce the board area.
BTB connector female seat, model U176CV.
BTB connector male seat, model 1UQ.
|2. Samsung Galaxy Buds2 earbuds teardown
Entering the disassembly part of the headset, pry open the cavity along the mold line, and the internal structure is further simplified compared to the Galaxy Buds Pro.
The inner structure of the back cavity of the shell uses an injection molding process to fix the touch sensor, print the LDS laser antenna, and connect to the main board dome through metal contacts. The openings of the two microphones are equipped with a sealing rubber ring structure to improve the sound reception performance.
The main components in the earphone are fixed on the pink plastic bracket, and the main board unit is on the top.
The side motherboard cable and battery cable are connected through the BTB connector.
The battery cable is fixed on the inside of the bracket, making the overall circuit very clean and tidy.
The positive and negative poles of the battery are soldered and reinforced with glue, and at the same time play a role in insulation.
The circuit on the side of the motherboard, the components are arranged neatly and orderly, which is full of beauty.
Circuit on the other side of the motherboard.
Connect the metal dome of the bluetooth antenna.
BES BES2500ZP bluetooth audio SoC, supports active noise reduction (including feedforward noise reduction, feedback noise reduction, hybrid noise reduction, adaptive noise reduction, AI voice noise reduction), and supports three microphones to achieve high-definition call noise reduction. The chip also has strong radio frequency performance, with an average power consumption of less than 5mA, which can realize long battery life or small size earphone design.
The full range of BES2500 supports bluetooth V5.2, the built-in MCU frequency is up to 300MHz, and supports LE Audio-LC3 technology, which can provide higher sound quality at the same rate.
According to 52audio, the BES2500 series has been sold under various brands such as OPPO and Honor. BES bluetooth audio solutions have been widely adopted by Samsung, Xiaomi, OPPO, JBL, Wanmo, Honor, Baidu, OnePlus, Transsion and other brands of true wireless headsets.
Silkscreen 356H IC.
Another preset metal dome.
Laser carving G246 1A07’s MEMS feed-forward noise reduction microphone is used to pick up external environmental noise.
Silk screen KZ1RG IC.
ST LSM6DSL, a high-performance 6-axis sensor, integrated acceleration and gyroscope, mainly to achieve the tap function and head rotation tracking, used to achieve the 360-degree sound function of the headset.
Samsung’s self-developed MUB01 chip integrates five components (fuel gauge, DC/DC converter, linear charger, low dropout/LDO regulator and reset IC) into a single chipset, saving board space, and charging case The MUA01 in the package supports firmware update.
The IC of silk screen DN1TC.
ST LIS25BATR high-bandwidth voice acceleration sensor is applied to the voice detection function and call noise reduction function of earphones. Compared with the traditional dual Mic solution, the bone vibration sensor has better suppression of wind noise/environmental noise.
According to 52audio, audio products of brands including Apple, Amazon, Samsung, Huawei, Xiaomi, vivo, Edifier, Mobvoi, etc. all use ST sensors.
Laser carving S259 1213 30FE MEMS microphone is used for voice call pickup.
The headset battery is fixed inside the pink bracket.
The bracket is fixed by a buckle, which can be easily removed and is also convenient for production and assembly.
Magnetic separator covering the nickel plate of the battery.
The earphone uses a steel shell button battery, model: NS1250, size: 12mm (diameter), 5.0mm (thickness), rated voltage: 3.85V, rated capacity: 58mAh. From Samsung SDI Co., Ltd.
The bracket and the front cavity are fixed by a buckle.
The internal components of the front cavity, speakers, optical sensors, charging contacts, and backfeed noise reduction microphone components are connected to an FPC cable.
The cavity parting line is provided with a sponge pad to improve the waterproof performance of the earphone.
The metal contacts on the cable for charging the earphones.
Double moving coil speaker unit.
Take out the cable and the internal structure of the cavity.
Front cavity FPC cable front.
The back of the FPC cable.
The sound unit in the earphone uses a dual dynamic module with the same structure as the Samsung Galaxy Buds+. A tweeter is paired with a woofer, and a three-frequency balanced audio effect is achieved through a two-way dynamic speaker.
The side of the speaker is fixed with a back-feed noise reduction microphone.
The sound hole of the loudspeaker is fixed to the sound tube of the front cavity through a sponge paste.
There is silk-screened model information J1617G on the speaker module.
The length of the speaker module is about 6.2mm.
The thickness is about 5.89mm.
Metal contacts for charging the headset.
Infrared optical in-ear detection module.
Laser carving S259 1224 30F3 feedback noise reduction microphone, used to pick up the internal noise of the ear canal.
All components of Samsung Galaxy Buds2 true wireless noise canceling earbdus.
The appearance design of Samsung Galaxy Buds2 true wireless noise reduction headphones, the charging case continues the overall appearance of Galaxy Buds Pro, a new design in color matching, through the internal and external two-color splicing, making the product more lively and interesting. Compared with the Galaxy Buds Pro, the headset presents two styles in the overall texture. The integrated round body design, with colorful color matching, presents a more youthful temperament.
In terms of internal structure design, the modular design of Samsung Galaxy Buds 2 has been further optimized. The charging case and the internal components of the earphone are fixed on the bracket, and the components are mostly connected by BTB, metal dome and other connectors, making the overall internal structure look cleaner and more orderly.
The charging case mainly includes two PCB boards, battery modules and wireless charging receiving coils, supporting Type-C interface wired and wireless input power. The Samsung MUA01 integrated power management chip is responsible for charge and discharge management. It also has a built-in MCU and embedded flash memory (eFlash), which can upgrade the firmware over the air and feedback the charging case power status. The built-in lithium battery has a capacity of 472mAh, from ATL.
Inside the Samsung Galaxy Buds 2 earbuds, the speakers use dual dynamic modules with the same structure as the Galaxy Buds+, a tweeter and a woofer, to achieve better audio quality through crossover technology. Three built-in MEMS microphones are used for active noise reduction and voice call functions. Infrared optical sensor realizes more accurate ear detection function. The headset uses a 58mAh steel shell button battery from Samsung SDI Co., Ltd., which is fixed in the middle of the bracket to provide better protection.
On the motherboard, the main control chip uses BES BES2500ZP low-power bluetooth audio SoC, bluetooth 5.2, supports active noise reduction, three-mic call noise reduction and other functions. The MUB01 chip independently developed by Samsung is responsible for the power management of the headset, battery display, firmware upgrades, etc. ST LIS25BATR high-bandwidth voice acceleration sensor, used for headset voice detection and call noise reduction. ST LSM6DSL high-performance 6-axis sensor realizes tapping function and head rotation tracking for touch operation and 360° sound function.