The TWS headset product market is booming. According to different usage scenarios, it has expanded into many types such as noise-cancelling headsets, business headsets, and gaming headsets. As a well-known esports external equipment brand, Razer also launched the HAMMERHEAD series of TWS gaming headset products, featuring ultra-low latency, immersive sound effects and other functions.
Razer Hammerhead X is the third product in the series recently launched by Razer. It continues the family-style design style in appearance. The back of the headset is equipped with a classic green Razer LOGO light, which is full of gaming style. In terms of functional configuration, a built-in 13mm drive unit, bluetooth 5.2 chip, support touch operation, support 60ms ultra-low latency. The longest single battery life is 7 hours, and the overall battery life is 28 hours.
Prior to this, 52audio also teradown the Razer Hammerhead TWS and Razer OPUS X. Let’s take a look at the internal structure design of this product.
|1. Razer Hammerhead X Charging case teardown
After unpacking, we have a general understanding of the appearance design of Razer Hammerhead X. Let’s move on to the disassembly part to take a look at its internal structure and configuration.
Pry open the charging case and take out the cockpit. The main circuit is set at the bottom of the charging case.
At the bottom of the headset cockpit, three magnets are used to absorb the headset and charging case.
The charging case shaft has a spring to provide a damping feel.
The main components in the charging case are fixed on another frame.
The main board unit is fixed by screws on one side of the frame.
On the other side is the battery unit.
A Hall element is provided on the top FPC cable.
At the bottom is the Type-C charging port soldered on the motherboard.
RGB LED indicator light.
The Hall element with silk screen 0Ay senses the magnetic field change (Hall effect) when the charging case cover is opened/closed, and then informs the charging case control chip, and then informs the headset to connect/disconnect with the paired device to realize the function of opening and closing the cover.
Metal contacts for charging the headset.
The Hall element FPC cable is connected to the main board through the ZIF connector.
The main circuit in the charging case.
Rechargeable lithium-ion battery model: 682723, rated capacity: 410mAh/1.558Wh, nominal voltage: 3.8V, charging limit voltage: 4.35V, factory date: April 28, 2021, from Chongqing VDL Electronics Co.,Ltd..
The silk-screen information on the battery cell is consistent with the external label.
The battery is equipped with a circuit protection board, which is responsible for the protection functions of the battery such as overcharge, overcurrent and overdischarge.
The circuit on the front of the motherboard.
The circuit on the back of the motherboard.
There are self-recovery fuse, TVS and over-voltage and over-current protection chip at the input, Willsemi ESD56241D18 18V TVS protection tube for input over-voltage protection.
The LPSemi LP5305 overvoltage and overcurrent protection IC also supports front-end protection of the lithium battery charger, disconnecting the charger input when the battery is overvoltage, providing a complete and comprehensive protection function.
SinhMicro SS881A is an 8-bit low-power Flash microcontroller with integrated charge and discharge management, integrated power management unit and charging management unit, and provides real-time configurable charging voltage and current settings with full software. SS881X is one of the products of SinhMicro POWR MCU series. The chip integrates rich power management functions to meet the overall requirements of the product for charging flexibility and safety.
In response to the intelligent trend of TWS products, the SS881X series has achieved two-way communication with major mainstream headset platforms, and the products can be iterated quickly. And the chip integrates a dedicated interface to support USB upgrades and production testing.
According to 52audio, many TWS headset charging cases including Edifier, Redmi, OPPO, 1MORE, ZMI, realme, FIIL, Anker, Lenovo, LINNER, Astrotec, Nubia and other brands have adopted SinhMicro’s solution.
The IC of the silk screen IeCTA, from SILERGY, is used to boost the output of the charging case battery to charge the earphone.
|2. Razer Hammerhead X earphones teardown
Razer Hammerhead X earphones adopt a handle-shaped semi-in-ear design, and the appearance curve continues the design style of the previous generation.
The back of the headset is designed with a classic Razer LOGO indicator, which is also a touch area.
At the bottom of the headset, two metal contacts are used to charge the headset, and the middle is a call microphone.
The pressure relief hole on the top of the earphone is covered by an internal dust-proof net.
The sound mouth of the earphone is protected by a metal dust-proof net inside to prevent foreign objects from entering the sound cavity.
There is also a pressure relief hole on the inside of the earphone to balance the pressure of the inner and outer ears and improve the wearing comfort.
Pry open the earphone with heat along the parting line.
The speaker wire inside the front cavity is welded to the rear cavity FPC board, and the FPC board has a BTB connector to connect to the main board.
The speaker is fixed in the front cavity by glue.
Open the BTB connector.
BTB connector female seat.
Below the FPC board is the battery unit.
Solder off the speaker solder joints to separate the front and rear cavities.
Disassemble the headphone head.
The front of the button-type soft-pack battery has a two-dimensional code printed on it.
On the back of the battery, there is also a silk-screened QR code.
On the back of the speaker unit, there are multiple tuning holes around the magnet, which are covered by mesh.
After actual measurement, the size of the Razer Hammerhead X headset speaker is about 13mm.
The magnet unit inside the earphone is fixed on the cavity wall by glue for adsorption with the charging case.
Take out the small indicator light board, the bottom of the cavity is the touch sensor, and the sensor is perforated to guide light.
There are three LED indicators around the circuit on the small indicator light board.
Silk screen AMCK IC.
The touch detection IC of the silk screen LWT1.
The IC of the silk screen OQ14.
Circuit on the motherboard side.
Circuit on the other side of the motherboard.
PXI PAU1823 bluetooth audio SoC, PAU1800 series has multiple models, supports bluetooth 5.2 dual mode, built-in 2 CPUs and 2 DSP processors, integrated stereo audio codec, battery charger, and memory and host interface peripherals, etc., Some models also integrate low-power digital active noise cancellation (ANC) technology.
The MEMS microphone of LaserDiao R051 is used for call sound pickup.
Ceramic bluetooth antenna.
All components of the Razer Hammerhead X in-ear headphones.
Razer Hammerhead X true wireless in-ear headphones continue the design style of the series in appearance design. The charging case adopts a vertical rounded square design, which can be opened with one hand for easy use. The earphone adopts a handle-shaped semi-in-ear design, which improves the comfort of long-term wearing of audio-visual games. The classic green Razer LOGO light on the back adds a sense of mystery to this product.
Inside the charging case, it is equipped with a 410mAh lithium-ion soft pack battery and uses a Type-C charging interface to input power. The input front end is protected by Willsemi ESD56241D18 TVS protection tube for input overvoltage, and LPSemi LP5305 provides overvoltage and overcurrent protection. SinhMicro SS881A microcontroller, integrated power management and charge and discharge management, to charge the built-in battery. charging case Built-in SILERGY boost chip, boost output of built-in battery to charge earphones.
The part of the Razer Hammerhead X headset uses a 13mm large-size dynamic driver with a two-dimensional code printed on the battery without clear information. The speaker, battery, touch sensor and LED indicator board are connected to a FPC board, and then connected to the main board through a flat cable and BTB. On the motherboard, the main control chip uses PixArt PAU1623B1-S2 bluetooth audio SoC, bluetooth 5.2, integrated power management. And a MEMS microphone is used for voice call pickup.
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detailed and explained teardown! 🙂