Gaming headphones, especially head-mounted ones, generally use exaggerated colorful indicator strips and lighting effects to attract the attention of game players. However, Razer recently launched an OPUS X head-mounted noise-cancelling bluetooth headset, featuring bright color schemes. The appearance is more fashionable, the headset has low latency characteristics, and it is aimed at the mobile game enthusiast group.
Razer OPUS X comes in three colors of green, pink and silver. The head beam and earmuffs on both sides are sprayed into a uniform color, which does not look like a gaming headset. Razer OPUS X uses Bluetooth 5.0 wireless connection. There are game modes that can be switched by buttons. The audio transmission delay can be as low as 60ms, which makes the audio and picture more synchronized, which is convenient for game operation. The headset also supports the ANC function, which eliminates some environmental noises and makes the game more focused. At the same time, the headset is also equipped with a “quick response mode”, which is the ambient sound mode often referred to on TWS earbuds, and you can understand the environmental conditions without taking off the headset.
Razer OPUS X is equipped with two 40mm dynamic drive units and adopts a feed-forward noise reduction scheme to support call noise reduction. The headset is charged with a USB-C interface, and the active noise reduction is enabled for about 30 hours, and the active noise reduction is disabled for about 40 hours. Let’s take a look at the detailed disassembly.
| Razer OPUS X noise-canceling headphones teardown
Dismantling starts from the ear pads, snap-in structure, dismantling you can see the sponge inside.
The ear pads are made of fine nylon mesh.
There are L/R marks on the shell inside the ear pads.
The sound hole of the speaker unit has a sponge pad, which is dust-proof on the one hand, and also has a certain sound filtering effect on the other.
The inner structure of the sponge pad.
The internal structure of the left earmuff is displayed, and it is fixed by multiple screws.
Dynamic driver diaphragm position.
Pressure relief/tuning hole near the dynamic driver.
The internal structure of the left earmuff is shown, the left side is mainly the battery circuit, and the right side is the main board circuit.
The battery module is connected to the main board through wires and connectors, which is convenient for factory assembly and production.
The soft pack battery used in the headset comes from VDL, model 553450, with a rated capacity of 1000mAh/3.7Wh and a rated voltage of 3.7V.
The product information on the other side of the battery is basically the same.
The battery protection board is responsible for the overcharge, overdischarge and overcurrent protection of the battery, and the thermistor detects the battery temperature.
On the inside of the earmuff shell, there is an electret microphone for active noise reduction.
The electret microphone is sealed with a lot of black glue.
Strip pressure relief hole with dust-proof net inside.
Take out the microphone, and use a metal dust-proof net cover at the pickup hole.
The electret microphone is placed in a silicone cover.
The cavity where the speaker unit is located is independently sealed.
The seams are reinforced with transparent glue.
The circuit is shown on one side of the small board, and the wire solder joints of the left and right earphones are separated on both sides.
The circuit display on the other side of the small board is printed with the words “Samantha, JX200-17 BAT V2.0”.
Heat and remove the cover at the speaker unit.
The structure of the magnet side of the speaker unit is shown.
According to 52audio’s actual measurement, the diameter of the dynamic speaker unit is about 40.18mm, which is consistent with the official publicity.
Next, continue to disassemble the right earmuff.
There is also an R mark on the ear pad shell.
The internal structure of the right earmuff is displayed.
There is also an electret microphone on the inside of the housing for active noise reduction to pick up ambient sound.
The internal circuit of the right earmuff is shown. There are also two electret microphones on the left and right sides for active noise reduction. The three PCBs are all fixed with screws and connected by FPC.
The electret microphone used for call pickup is also protected by a silicone cover and sealed with a large amount of black glue.
The small board where the charging interface is located is connected to the small board of the main control chip through the FPC.
The small board where the jog button and indicator light are located.
There is a rubber post to extend the button position to adapt to the shell structure.
In addition to fixing with screws, the connecting position of the baffle is also reinforced with glue.
The circuit of the small board where the charging interface is located is shown. The small board has a self-recovery fuse and TVS for input protection.
There is foam filling between the small board where the main control chip is located and the sound cavity shell.
Circuit display on the motherboard side.
The circuit on the other side of the motherboard is shown, and there is a metal shield outside the main control chip.
LPS LP5301B6F, 36V overvoltage and overcurrent dual protection chip. The addition of this high-voltage-resistant IC can effectively avoid the high-voltage impact of the earphone circuit caused by the misoperation of the charger, and can effectively improve the safety and stability of the product.
The triode of the silk screen 1AM.
MPS MP2662 500mA linear lithium battery charging IC, supports power path management, supports I2C control, and supports 21V input withstand voltage.
The IC of silk screen AC.
Open the metal shield to see the relevant circuit of the main control chip.
The main control chip of Razer OPUS X is BES BES2300Y. There are multiple versions of BES2300, with different suffixes and different configurations.
The BES BES2300 series supports bluetooth 5.0, IBRT low-frequency forwarding technology and dual-mode bluetooth 4.2. It also supports the third-generation FWS full wireless stereo technology, dual microphones, etc., supports external sensor devices such as heart rate sensors, acceleration sensors, and eMMC flash memory.
BES2300Y supports ANC active noise reduction. It has been applied in Honor FlyPods 3 true wireless ANC earphones, Xiaomi neck-mounted ANC bluetooth headset, OPPO Enco Q1 neck-mounted ANC bluetooth headset and other products.
The headset transmits the signal through the onboard bluetooth antenna.
Razer OPUS X head-mounted noise reduction bluetooth headphone all components.
The Razer OPUS X head-mounted noise reduction bluetooth headset has beautiful colors, a simple design, supports active noise reduction, and has low latency. You can also choose a variety of sound effects when downloading the Razer APP, which is more suitable for daily wear and game scenes. The earphone uses a metal head beam, with protein leather inside the top, and the ear pads are composed of protein leather and nylon to improve wearing comfort.
The earphone inputs power through the USB-C interface, and there is a self-recovery fuse and TVS at the charging interface for input protection. LPS LP5301B6F supports 36V overvoltage and overcurrent dual protection to avoid high-voltage shocks caused by incorrect operation of the charger. The internal circuit is safe. The measures are outstanding. MPS MP2662 is a 500mA linear lithium battery charging IC, supports power path management, supports I2C control, and is responsible for charging the battery. The soft pack battery comes from VDL, with a rated capacity of 1000mAh, large capacity and low-power chips to achieve long battery life.
The active noise reduction function of Razer OPUS X uses a feedforward noise reduction solution. There are two feedforward microphones in the left and right earphones to collect ambient noise for active noise reduction. The bluetooth master chip and noise reduction chip is BES BES2300Y. There is also an electret microphone in the right earmuff for call sound pickup, and the call noise reduction function reuses the feedforward microphone. The diameter of the dynamic speaker unit is about 40mm.