Edifier announced two flagship TWS earbuds at its 25th anniversary, Edifier NeoBuds Pro and Edifier NeoBuds S. The two products use the same exterior design and different audio solutions. The former supports LHDC/LDAC high-definition audio codec, and the latter supports the Qualcomm Snapdragon Sound audio technology platform.
The Edifier NeoBuds S true wireless hybrid noise cancelling earphones, which will be teardown this time, will be launched in 2022, and inherit the design language of the NeoBuds series in terms of appearance. Added an indicator light similar to the “supercar taillight”, with a gradual breathing light effect, and the switch cover is like a sports car on/off.
In terms of functional configuration, it is equipped with a composite diaphragm dynamic+Knowles armature driver. Through the active electronic frequency crossover technology, the advantages of the two units are complemented to achieve a pure sense of hearing with three-band equalization. Support Qualcomm aptX Adaptive, aptX Voice audio technology, provide high-definition audio and video, call wireless audio experience. It also supports -42dB mixed active noise cancelling, ambient sound monitoring, call noise cancelling, game mode, etc.
We has previously disassembled Edifier NeoBuds Pro, Edifier LolliPods Pro, Edifier FunBuds, Edifier TWS NB2, Edifier MiniBuds, Edifier HECATE GM45, Edifier HECATE GM4 MINI, Edifier DreamPods bone conduction headphones, etc.
$179 – EDIFIER NeoBuds S Review
01/ Edifier NeoBuds S charging case teardown
Through unboxing, we have a detailed understanding of the unique design of the Edifier NeoBuds S. Enter the teardown section below to see the internal structure configuration information.
Pry open the charging case cover and separate the bottom cover. A battery unit is fixed on the inner side of the cover plate, and is connected to the main board by wire welding.
Take out the battery, charging case side structure of the cockpit. The top power input board is connected to the motherboard through a cable.
The structure on the other side of the cockpit.
The power input small board and the main board are fixed by screws on the bottom of the cockpit.
Remove the screws one by one and take out the main components in the charging case.
The bottom structure of the cockpit is equipped with multiple magnets to absorb the charging case cover and earphone for better fixation.
The circuit on one side of the main components in the charging case, including the main board, the power input board, the battery, and the FPC cable connecting the Hall element.
The circuit on the other side of the main components in the charging case.
The charging case has built-in lithium-ion rechargeable battery Model: CEL13300, rated voltage: 3.7V, rated capacity: 500mAh/1.85Wh, from Dongguan CEL Battery Technology Co., Ltd., made in China.
The positive and negative electrodes of the battery are welded on the circuit protection board and are connected to the motherboard through three wires.
Battery circuit protection board circuit.
The protection board is provided with a silk-screen Y1AY lithium battery protection IC and an 8205 MOS tube, as well as a thermistor used to detect the battery temperature.
The circuit on one side of the power input small board is provided with a Type-C charging socket and an overvoltage protection IC.
The Wayon WP1430 overvoltage protection IC automatically disconnects the system from its output pin (OUT) when a false input operating condition is detected. The WP1430 has positive overvoltage protection up to 36V. The internal overvoltage threshold (OVLO) is 6.1V and the overcurrent threshold (OCP) is 2.5A. There is also an internal over-temperature protection (OTP) feature that monitors the chip temperature to protect the device.
The circuit on the other side of the power input small board is connected to the main board through the FPC cable.
The other end of the cable is equipped with a silk-screened AJOz Hall element, which is used to monitor the magnetic field changes when the charging case cover is opened/closed, and then notify the charging case MCU and earphones to pair or disconnect from the connected device.
The circuit on one side of the charging case motherboard.
The circuit on the other side of the charging case motherboard.
TPS SY8801 TWS earphone charging compartment SOC, specially designed for TWS earphone charging compartment. Based on the design to ensure safety and high reliability (supports 28V input withstand voltage, built-in full-featured charging and discharging overvoltage, overcurrent, overtemperature, short circuit protection, etc.), it also integrates I²C communication function and internal communication isolation function . Through the I2C interface, the MCU of the system can read and configure the internal functions of the power supply and the parameters of battery charge and discharge management, and easily realize such as NTC protection, segmental adjustment of battery current, TWS headset storage, storage detection, and power output automatic opening and other functions.
The integrated internal communication isolation module of TPS SY8801 greatly optimizes the functional design of the smart TWS charging compartment. No complicated peripheral circuits are required, and the MCU can be realized by connecting and controlling the SY8801. It can not only realize the function of charging the earphone, but also transmit data through the POGO PIN of the power supply connected to the earphone, realizing functions including uploading the power of the charging compartment, clearing the pairing of the earphone in the charging compartment, restoring the factory settings, and upgrading the software of the earphone.
According to 52audio, the power management chip of TPS has been adopted by Baseus, Xiaomi, OPPO, OnePlus, realme, Transsion, 1MORE, Baidu, Edifier, JBL, HARMAN, Lenovo and other brands.
The inductance of silk screen 3R3 is used to charge the earphone with the boost circuit inside the power management chip.
Bluetooth pairing function button on the motherboard.
SinhMicro SS881A microcontroller belongs to SinhMicro POWR MCU SS881X series, with rich interface functions and flexible configuration modes. Supports different low-power options for portable electronics that require battery charging as well as smart control. The charging voltage and current of the battery can be flexibly configured through software, and a complete protection function is built in, and the chip itself has passed the IEC62368 certification. It can bring a streamlined periphery, excellent performance and flexible and convenient development to TWS earbuds products.
SinhMicro SS881X input supports 14V withstand voltage, high voltage version supports 40V withstand voltage, supports multiple reset methods, built-in 8-channel 12-bit ADC for current and voltage acquisition. Built-in capacitive touch button sensor, support I²C and UART interface, integrated programming/debugging interface, support whole machine upgrade. Built-in four-way PWM signal output, can be used for breathing light drive.
According to 52audio, there are currently Black Shark, Xiaomi, OPPO, Honor, Redmi, realme, Nubia, Lenovo, Nokia, HTC, Edifier, Soundcore, 1MORE, FIIL, 233621, JBL, Philips, Skullcandy, Razer , ZMI, Astrotec, LINNER, AbramTek and other brands of TWS earbuds products use the SinhMicro solution.
Sinhmicro SS881Q POWER MCU, also a product of Sinhmicro SS881X series, adopts 4*4mm QFN24 package for lighting control.
Silkscreen SHNOC IC.
The indicator light on the main board adopts 16 SMD LEDs, supports 8 kinds of color display, and realizes the same on and off effect as “sports car tail light” through drive control.
LED driver circuit.
02/ Edifier NeoBuds S earphones teardown
Go to the earphone teardown section. Pry open the headphone handle cover to reveal the internal structure of the cavity.
The inner side of the cover plate is provided with a microphone acoustic structure at both ends of the inner side of the cover plate to improve the sound collection performance. A bluetooth antenna and a touch detection patch are arranged in the middle, and the exposed copper is connected to the motherboard.
Inside the earphone handle is a motherboard unit that fits the cavity and is fixed by a positioning column. The cables of the components in the headphone head are connected to the motherboard through the BTB.
BTB connector for connecting components inside the earphone head.
Remove the motherboard and open the earphone cavity.
The circuit on the side of the earphone motherboard.
The circuit on the other side of the earphone motherboard.
The Qualcomm QCC5151 bluetooth audio SoC is an ultra-low power single-chip solution in a WLCSP package with a smaller size. It supports Bluetooth 5.2, with programmable DSP, optimized for true wireless headphones and hearing devices, and designed to support the new generation of bluetooth audio technology standard LE Audio.
Qualcomm QCC5151 combines high-performance audio with low power consumption, supports 24bit/96KHz high-resolution audio, and supports Qualcomm aptX audio encoding, including aptX™ Adaptive technology. Support aptX™ Voice to optimize call voice and 8th generation Qualcomm cVc echo cancellation and noise suppression technology. Integrated Qualcomm adaptive active noise cancelling, including feedforward, feedback, blending and adaptive, supports third-party innovation through Qualcomm extensions.
According to 52audio, there are many TWS true wireless earphones, head-mounted, neck hanging bluetooth headphones, smart speakers, smart audio glasses and other audio products that use Qualcomm bluetooth audio SoC.
The two metal copper pillars on the motherboard that charge the earphone are provided with rubber pads at the bottom to connect with the shell, which plays the role of sealing and waterproofing.
Silkscreen 3460 IC.
Laser engraving 1031 2031 MEMS microphone, used for noise cancelling function to pick up external environmental noise.
The microphone pickup hole on the motherboard is provided with a dust-proof net to prevent foreign objects from entering.
Acceleration sensor for silkscreen QR code for tap control function.
Laser engraving 1031 2031 MEMS call microphone, used for voice calls to pick up human voice.
Silkscreen 052AB U64X memory IC.
Metal dome for connecting the bluetooth antenna.
Silkscreen O7 LJ IC.
The internal circuit of the earphone head, all components are connected to an FPC cable.
There is a lithium battery protection IC with silkscreen 1h AF on the FPC cable.
The solder joints of the speaker, battery, and microphone on the cable.
Melting point soldering point, take out the battery, and a plastic plate is also arranged in the front cavity to isolate the battery and the speaker unit.
Remove the plastic cover, the internal structure of the front cavity.
Remove the dynamic driver, and connect the armature driver and the noise cancelling microphone below through the cable.
Dismantling the components in the earphone head, including the battery, dynamic driver, armature driver and microphone.
The front of the dynamic driver is applied to the mid-low frequency band to provide more natural and fuller low-frequency sound.
The back of the dynamic driver is engraved with the word “CY”.
After actual measurement, the size of the dynamic driver is about 10mm.
The armature driver circuit carried by earphone.
The Knowles armature driver of radium engraving 62743 is applied to the middle and high frequency bands, providing rich sound details for the earphone. Through the combination of dynamic+rmature driver and patented active electronic frequency crossover technology, it provides a pure sense of hearing with three-band equalization.
The MEMS microphone of the laser carving 2146 8X04 is a back-feed noise cancelling microphone, which is used for the noise cancelling function to pick up the noise inside the ear canal.
The earphone uses a steel shell button battery, model: M1154S3, voltage: 3.85V, capacity: 0.212Wh, from MIC-POWER.
Edifier NeoBuds S true wireless hybrid noise cancelling all components of earphones.
Edifier NeoBuds S true wireless hybrid noise cancelling earphones have unique brand features in appearance design and are highly recognizable. The charging case adopts a symmetrical and irregular shape design, and enriches the layering of the product through different materials. 8 color-adjustable “sports car taillights” designs add interest to the product. The handle-shaped in-ear earbuds are still full of three-dimensionality, but the arc transition is adopted at the edges and corners, and the look is softer.
In terms of internal configuration, compared to the Edifier NeoBuds Pro, it adopts a completely different scheme. The charging case uses the Type-C interface to input power, and the port is equipped with Wayon WP1430 overvoltage protection IC. Built-in battery 500mAh, from CEL, equipped with circuit protection board and lithium battery protection IC. The motherboard adopts TPS SY8801 charging bin SOC, SinhMicro SS881A and SS881Q POWER MCU, etc., which are used for charging case charging and discharging management, data communication, LED light driving and overall control functions.
The earphone is equipped with a 10mm dynamic+Knowles armature driver, a built-in MIC-POWER 0.212Wh steel shell button battery, and a single earphone has 3 MEMS pickup microphones. The main control chip is Qualcomm QCC5151 flagship bluetooth audio SoC, supports Bluetooth 5.2, has programmable DSP, supports Qualcomm Snapdragon Sound technology, integrates Qualcomm adaptive active noise cancelling function, and provides immersive high-definition wireless audio experience for earphones.