With the popularity of TWS headsets, many manufacturers have entered this market. As a well-known digital accessory brand, UGREEN has also made an in-depth layout in the TWS headset market. At present, it has launched HiTune “X” “T” “H” and other series of products. It includes comfortable to wear semi-in-ear earphones, ENC call noise cancellation earphones, and the first ANC (active noise cancellation) earphone to be disassembled this time.
UGREEN HiTune X6 true wireless noise cancellation earbuds are unique in appearance. The headset continues the dual oval structure design of UGREEN HiTune X5, with a unique curve of the fuselage and a very high degree of recognition, and the product is more textured through different process treatments.
In terms of functional configuration, UGREEN HiTune X6 is equipped with a 10mm DLC-type diamond diaphragm dynamic driver, bluetooth 5.1 chip, supports active noise cancellation, six-mic call noise cancellation, and a maximum noise cancellation depth of 35dB. Support game mode, further reduce the delay and enhance the game experience. It supports IPX5 waterproof, coping with sports and fitness scenes, and has a single battery life of 6 hours and an overall 26 hours of battery life.
52audio also teardown the UGREEN HiTune T2, UGREEN HiTune T1, UGREEN HiTune WS100, wireless lavalier microphone, Apple in-ear wired headset and USB car bluetooth audio receiver. Let’s take a look at the detailed dismantling report of this product.
|1. UGREEN HiTune X6 charging case teardown
Pry open the charging case shell and take out the headphone cockpit structure.
The function button keycap on the shell.
The front circuit of the cockpit is fixed with an FPC cable, and the cable is equipped with indicator lights and Hall elements. The battery is located in the abdomen of the stent, which plays a very good protective role.
A bluetooth pairing function button is provided on the cavity on the back of the cockpit.
The side structure of the cockpit has a buckle structure for fixing with the shell.
The main board unit is fixed by screws at the bottom of the cockpit.
Remove the screws, pick up the connector, and remove the motherboard.
Remove the motherboard and battery unit.
The frame for fixing the battery is fixed on the cockpit by screws.
The frame structure of the headset cockpit is disassembled.
A plurality of magnets are arranged at the bottom of the earphone cockpit to absorb the earphone and the charging case cover.
FPC cable circuit.
Bluetooth pairing jog button.
Two LED indicators of different colors.
With the Hall element of silk screen 8891X, the magnetic field changes when the charging case cover is opened and closed will be sensed by the Hall element, and the charging case MCU will be notified to control the pairing or disconnection of the headset with the connected device.
The headphone uses a soft pack battery, model: SP902030, rated voltage: 3.7V, capacity: 1.85Wh/500mAh.
The lithium battery is equipped with a protection board, which is equipped with an integrated lithium battery protection IC and a thermistor that detects the battery temperature.
The back of the circuit protection board.
The circuit on the front of the motherboard.
The circuit on the back of the motherboard is attached with a square sponge pad to isolate it from the battery.
A non-standard MCU.
The charging case uses TPS SY8815 bluetooth headset charging bin solution. Internally integrated charging module and discharging module. The charging current can be adjusted externally; the discharging module integrates two output current limit switches, providing independent load presence detection and load insertion detection, and supports output current detection.
SY8815 supports discharge enable control, and MCU can directly control the discharge function of the chip flexibly through EN. SY8815 integrates a single-wire status code output, which is convenient for the chip to report the chip status to the MCU. SY8815 is very suitable for the design of the bluetooth headset charging compartment, which greatly simplifies the peripheral circuits and components, and provides a simple and easy-to-use solution for the application of the bluetooth headset charging compartment.
According to 52audio, the TPS power management chip has been adopted by many well-known brands such as Soundcore, F&D, OPPO, Xiaomi, Baidu, 1MORE, 233621, Transsion, Sabbat, Creative, and OnePlus.
Connect the ZIF connector of the FPC cable.
Pogo Pin connector on the motherboard for charging the headset.
Type-C charging interface female socket sink plate welding, reduce the thickness of the motherboard.
|2. UGREEN HiTune X6 earbuds teardown
Enter the disassembling part of the earphone, pry the earphone along the moulding line, the battery is inside the cavity.
Open the cavity and take out the battery.
The internal structure of the front cavity is provided with a metal cover plate, which is sealed with glue to form an independent sealed sound cavity.
A metal plate is provided to reinforce the FPC cable inside the rear cavity, and the metal plate is attached to the battery.
Pry open the back panel of the headphone handle.
The inner structure of the cover, the bluetooth antenna and the touch detection patch are pasted on the cavity wall. Acoustic structures are provided on the upper and lower ends to improve the microphone performance.
The back plate is provided with an elliptical main board that fits the cavity, and is fixed by a positioning column. The FPC cable of the internal components of the headset is connected to the motherboard through the BTB connector.
Pick up the connector and take out the back cavity components and the internal structure of the back cavity.
FPC cable circuit inside the headphone head.
The metal cover inside the front cavity is fixed by a large amount of glue.
Remove the metal cover plate and the internal structure of the cavity.
Take out the speaker unit and the internal structure of the cavity.
A back-feed noise cancellation microphone is provided in the front cavity for picking up environmental noise inside the ear canal.
The internal components of the headphone head.
A steel button battery is used inside the earphone.
Steel shell button battery model LIR1240, from LIDEA.
On the back of the dynamic driver, there is a tuning hole, which is protected by a dust-proof net.
On the front of the speaker unit, you can see the DLC diamond diaphragm from the sound hole.
The battery and speaker wires are welded to the FPC cable.
The flat cable is connected to the motherboard through the BTB connector.
The rear-feed noise cancellation microphone is set at the end of the cable, laser carving 2133 3X02, the detailed model is SA2718B381-WJ02, from XinGang.
The internal structure of the earphone handle.
Take out the main board and the internal structure of the cavity.
Indicator light guide.
On the side of the motherboard, the three contacts are reinforced with red glue, and the microphone cover is also fixed with white glue.
On the other side of the motherboard is the main control chip.
The feedforward noise cancellation microphone on the main board is equipped with an acoustic rubber structure to improve the sound reception performance.
The laser carving 171 1N3 MEMS microphone is used to pick up external environmental noise and output it to the main control chip for processing.
Winsemi WSDF13 series lithium battery protection IC is a highly integrated solution for the protection of single-cell lithium-ion/lithium polymer rechargeable battery packs.
The WSDF13 series has all the protection functions required by batteries such as overcharge, overdischarge, overcurrent, short circuit, etc., with extremely low power consumption during operation. Using a very small DFN1x1-4 package, it is suitable for use in rechargeable battery packs with very small space constraints.
According to 52audio, the true wireless headset products of Edifier, FIIL, Meizu, BULL, Transsion and other brands have adopted Winsemi lithium battery protection solutions.
Silkscreen 2F IC.
Pogo Pin connector for connecting bluetooth antenna and touch detection patch.
The call microphone is also equipped with a rubber cover to improve the radio performance.
Laser carving 171 1N3 MEMS microphone is used for voice call pickup.
Two LED indicators of different colors.
The main control chip adopts Realtek RTL8773BFE bluetooth audio SoC, which supports bluetooth 5.1 specification. The chip adopts dual-core architecture, independent DSP to realize audio coding and decoding, ANC and ENC noise cancellation functions, bringing better music quality and noise cancellation effects. At the recent Realtek bluetooth Smart Audio conference in 2021, Realtek also upgraded this chip with hearing aid/listening aid functions, which can be upgraded for free. The free upgraded hearing enhancement function (Real Hearing Enhancement, RHE) can provide the same voice enhancement amplification, binaural volume balance, and sound quality adjustments like Airpods Pro. It can provide personalized hearing compensation adjustments for people with mild hearing impairment. .
Realtek RTL8773B supports ANC mixed noise cancellation mode, ANC opening increases power consumption <1mA, which significantly extends the headset battery life. Supports ultra-low latency transparent mode, which can restore a more natural environment sound. In terms of ENC, RTL8773B supports Realtek’s exclusive algorithm RCV4.0, which brings clearer call effects. At the same time, all Realtek solutions support APP development kits, allowing customers to feel more convenient and professional operating experience.
According to 52audio, the products of many well-known brands such as BULL, AUKEY, RAPOO, Anker, Haylou, Amazon, Anker, Astrotec, FIIL, JLab, Xiaomi, Redmi, QCY, Toshiba, etc. have been adopted.
The crystal oscillator that provides the clock for the bluetooth chip.
The gold-plated copper pillars on the motherboard that charge the earphones.
All components of UGREEN HiTune X6 true wireless noise cancellation earbuds.
UGREEN HiTune X6 true wireless noise cancellation earbuds have a unique design in appearance. Both charging case and earphones use two different processes to improve product texture. The appearance of the headset is round and smooth, and it has a comfortable and stable wearing effect. The unique oval headphone handle design also makes the product highly recognizable.
In terms of internal structure and circuit, the charging case is mainly composed of a motherboard, a battery and an FPC cable. The motherboard uses a Type-C interface input power source, a built-in soft pack battery with a capacity of 500mAh, and an integrated lithium battery protection IC. The TPS SY8815 bluetooth headset charging compartment solution is responsible for charging the built-in battery and discharging to charge the headset. The charging current can be adjusted externally, and the discharging module integrates two output current limit switches. One MCU is used for charging case control.
The internal speaker unit of UGREEN HiTune X6 earphone is equipped with an independent sound cavity structure to enhance the audio effect. A single headset is equipped with 3 MEMS microphones for voice calls and noise cancellation functions. The headset uses a LIDEA steel shell button battery and is equipped with Winsemi WSDF13A2N2N lithium battery protection IC. The main control chip is Realtek RTL8773BFE bluetooth audio SoC, supports bluetooth 5.1, built-in dual-core architecture, independent DSP to achieve audio codec, ANC and ENCnoise cancellation functions, to achieve better music quality and noise cancellation effects.
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