In terms of functional configuration, SoundPEATS Air3 Deluxe HS is equipped with a 14.2mm bio-diaphragm dynamic driver, supports LDAC audio codec, and has a wide sound field while ensuring rich sound details. Support dual-mic call noise cancellation, providing clear voice call effect. Support game mode, the latency is as low as 60ms. It adopts touch control, supports tactile in-ear detection, and can be used with APP for touch control and EQ preset. In terms of battery life, it supports a total battery life of 5+15H. Let’s take a look at the detailed teardown report of this product.
01/ SoundPEATS Air3 Deluxe HS charging case teardown
Remove the charging case shell and take out the internal cockpit structure.
The motherboard unit is set at the bottom of the charging cockpit and fixed by screws.
On the front of the charging cockpit, there is an FPC cable connecting the function buttons and indicator lights.
The other side of the charging cockpit is equipped with a battery unit and a cable connecting the Hall element.
Remove the screws and remove the main components on the charging cockpit. Including motherboard, battery and two FPC cables.
The bottom structure of the charging cockpit is equipped with 5 magnets for absorbing the charging case cover and earphones.
Hall element wiring circuit.
The Hall element of the silk screen qH2c is used to sense the magnetic field change when the charging case cover is turned on/off. Then notify the charging case MCU to control the pairing or disconnection of the earphones with the connected device.
Function button cable circuit, LED indicator light is set at the end for feedback of bluetooth pairing and charging status.
The charging case built-in lithium battery model: YJ701435, voltage: 3.7V, capacity: 300mAh/1.11Wh, from YANJOO.
The battery protection board circuit is equipped with DW01 lithium battery protection IC and 8205A MOS tube, and a thermistor for monitoring the battery temperature.
The back of the battery protection board.
The circuit on the side of the motherboard of the charging case.
The circuit on the other side of the charging case motherboard.
The charging case is the metal dome that charges the earphone.
LPS LP7801TE ultra-low power charging boost single chip, designed for charging/discharging small-capacity lithium batteries. Integrated linear charging management module, low power consumption synchronous boost discharge management module, built-in power MOS, externally programmable charging current, maximum charging current 1A. When 5V is normally on, the standby current of the whole earphone compartment is <10uA (including earphones, protection board).
LPS LP7801TE is packaged in ESOP-8, and the switch pin adopts high-voltage 9V technology, which can effectively absorb the high-voltage peak of production capacity when the earphone is plugged and unplugged, and at the same time, there is no howling sound within the full load capacity range (especially at light load). Built-in OVP, built-in NTC is precise and adjustable, the input withstand voltage is 28V, the input overvoltage protection component is omitted, and the standby current is 1uA. The efficiency of the boost module is as high as 95%, the switch pin has high withstand voltage, fixed 5.1V output, few peripherals, and small ripple.
According to 52audio, there are audio products under many brands such as Black Shark, SoundPeats, Xiaomi, Honor, OPPO, Huawei, Redmi, realme, Lenovo, Sony, Nokia, Motorola, Edifier, Soundcore, 1MORE, QCY, Razer, etc. LPS power management chip is adopted.
Cooperate with the power management chip to boost the built-in battery to charge the power inductor for earphone.
CHIPSEA CSU32P10 is an 8-bit CMOS single-chip RISC MCU with 12-bit ADC and built-in 2K×14-bit OTP program memory.
According to 52audio, currently Zepp Health Corporation, vivo, Redmi, UGREEN, ZMI, Philips, 1MORE and other brands have adopted CHIPSEA chip products in their TWS earbuds.
02/ SoundPEATS Air3 Deluxe HS earbuds teardown
Enter the earbuds teardown section. First pry off the earbud head along the parting line.
The internal structure of the rear cavity, the component cables in the earbud head are connected to the motherboard through BTB.
The internal structure of the front cavity, the super large dynamic unit covers the entire earbud cavity.
Take out the speaker, there is a bracket inside the front cavity, and the in-ear detection unit is fixed underneath.
SoundPEATS Air3 Deluxe HS earbud head internal components.
The internal structure of the front cavity and the tuning hole are protected by a fine dust-proof net.
The earbud uses a steel shell button battery inside, and the outside is wrapped and insulated by high-temperature tape.
Battery model: M1040S1, voltage: 3.7V, capacity: 0.111Wh, from MIC-POWER.
QR code is engraved on the negative electrode of the battery for product traceability.
The earbud speaker is a dynamic driver, with a bio-fiber diaphragm on the front, which provides a wide sound field and rich detail performance, bringing a surging bass effect.
On the back of the dynamic driver, the cable is soldered to connect the battery and the speaker.
After actual measurement, the size of the dynamic driver is about 14.2mm, which is consistent with the official announcement.
A SpaceTouch SPT513N precision in-ear detection chip is installed on the fixed cable of the bracket. It supports direct status output, I2C and UART interface output, and also supports touch sliding function to meet various application environments.
Capacitive in-ear detection sensor, used to automatically pause music playback when the earbud is removed, and automatically resume playback when wearing the earbud.
Open the headset stem, the internal structure of the cavity.
The bottom of the headset stem is the metal tail plug connector structure for earbud charging.
Take out the earbud motherboard.
The inner structure of the headset stem cover is used to fix the touch detection patch and the bluetooth antenna.
Circuits on the motherboard side.
Circuits on the other side of the motherboard.
The earbud is equipped with WUQI WQ7033M bluetooth audio SoC, which adopts the leading HIFI5 DSP+RISC-V chip architecture design. Support LDAC high-definition audio codec technology, and multi-microphone AI ENC noise cancellation. Deeply empowering SoundPEATS earphones to create a high-quality sound experience, becoming the world’s first half-in-ear earphones certified by Hi-Res.
WQ7033 series is a high-standard bluetooth audio SoC chip that supports BT/BLE 5.2 dual-mode protocol stack and the new generation of bluetooth audio technology standard LE Audio. Built-in high-performance HiFi 5 DSP and NPU (Neural Network Processing Unit) to support complex multi-microphone uplink noise cancellation algorithm and keyword wake-up, while taking into account low power consumption. Integrated Hybrid (FF+FB) ANC, can support earphones applications with high bandwidth and deep noise cancellation. Provides rich interfaces and high integration, suitable for advanced TWS noise cancellation earphones and other low-power products that require complex audio processing and voice AI capabilities.
It is understood that at present, many well-known brands such as Soundcore, MONSTER, Haylou, JBL, QCY, SoundPEATS, Noise, etc. have adopted bluetooth chips from WUQI.
The peripheral power inductor of the main control chip.
The 16.000MHz crystal oscillator provides the clock for the bluetooth chip.
It is used to connect the BTB to the machine socket of the internal components of the earbud head.
Metal dome used to connect the touch detection sensor.
LONGWECHIP LW6233CRB single-button touch detection IC has a built-in voltage regulator circuit to provide stable voltage for the touch sensing circuit. The stable touch detection effect can widely meet the needs of different applications. This touch detection chip is specially designed to replace traditional keys, and the size of the touch detection PAD can be designed within a reasonable range according to different sensitivities. Low power consumption and wide operating voltage are the characteristics of this touch chip in DC or AC applications.
The MEMS microphone of Laser Engraving 2867 GF23 is used to pick up sound with the noise cancellation function of the call.
Another laser engraving 2867 GF23 MEMS microphone is used for voice pickup.
Metal dome for connecting the bluetooth antenna.
The metal dome used to connect the metal tail plug to charge the earbud.
All components of SoundPEATS Air3 Deluxe HS true wireless earphones.
SoundPEATS Air3 Deluxe HS In terms of appearance design, the charging case adopts an oval design and weighs only 36.2g. The earbuds adopt a handle-shaped semi-in-ear design with a matte texture and a weight of about 4.2g. With a precise simulated ergonomic design, it provides a light and comfortable long-term wearing experience. The charging case and earbuds are also integrated with the golden brand LOGO nameplate, which effectively improves the product texture and recognition.
In terms of internal structure configuration, the charging case has a built-in YANJOO 300mAh battery and uses a Type-C interface to input power. The motherboard is equipped with LPS LP7801TE power management chip, which integrates a linear charging management module, a low-power synchronous boost discharge management module, and a maximum charging current of 1A, which is used to charge the built-in battery and boost the earbuds. Also adopted CHIPSEA CSU32P10 8-bit CMOS single-chip RISC MCU with 12-bit ADC for charging case control.
In terms of the earbud circuit, the earbud head uses a 14.2mm bio-diaphragm dynamic driver, a MIC-POWER 0.111Wh steel shell button battery, an in-ear detection sensor unit and a SpaceTouch SPT513N precision in-ear detection chip. They are connected in series on the same cable and then connected to the motherboard in the headset stem through the BTB connector. The motherboard is equipped with WUQI WQ7033M bluetooth audio SoC, which supports Bluetooth 5.2 and dual-mic AI call noise cancellation. Equipped with two MEMS microphones to provide clear voice call effect. LONGWECHIP LW6233CRB single-button touch detection IC is also used to realize convenient touch control.