Oladance OWS Pro adopts Mobius design, with ceramic skin, and its texture is fully upgraded. It is equipped with high-precision laminated speakers and adopts dual-chip driver (main chip + power amplifier chip). Supports intelligent bass algorithm compensation and dynamic equalizer algorithm technology. At the same time, the original reverse sound wave cancellation technology is used to reduce the sound leakage of the headphones.
Oladance OWS Pro supports three modes: focus, hearing protection and call wind noise protection. Supports multipoint connections – switch between multiple device connections freely. Supports a new pressure-sensitive touch interaction method, through two-finger pinch and sliding control, the control is more precise and convenient. The headphones can be used continuously for up to 16 hours at a time, and the total battery life reaches 58 hours. It supports fast charging and can be used to listen to music for 6 hours in 15 minutes. Let’s take a look at the detailed teardown report of Oladance OWS Pro.
$229 – Oladance OWS Pro Review
01/ Oladance OWS Pro Charging Case Teardown
Open the snap-on charging case and take out the charging bin structure.
The bottom structure of the charging bin has the battery fixed on the upper layer and the motherboard fixed on the lower layer through screws. Also, there is a small board for charging earphones and an indicator light FPC.
Remove all components from the bottom of the charging bin.
The bottom structure of the charging bin has four magnets in the middle to fix the earphones, and two magnets on the edge to fix the charging case cover.
The circuit on the side of the charging case motherboard.
The circuit on the other side of the charging case motherboard.
Cmsemicon CMS8S5887 microcontroller is used for controlling the charging case. CMS8S588x is an 8-bit chip with 8051 core, 1T command system compatible with MCS-51, and general IO type. Supports internal 48MHz, external 8/16MHz, built-in 5 16-bit timers, LSE_timer, WUT, BRT, high-precision 12-bit ADC up to 30 channels, 6-channel PWM module, built-in 2-channel USART module. Supports I2C and SPI modules, BUZZER and CRC functions.
TPS SY8809 charging bin solution integrates charging module and discharging module inside the chip. The charging module adopts NVDC architecture, and the charging current can be adjusted by I2C. The output voltage of the discharge module can be adjusted by I2C. It integrates two output current-limiting switches, provides independent load presence detection and load insertion detection, and supports output current detection. The chip integrates NTC protection function to charge and discharge the battery more safely.
SY8809 integrates a standard I2C interface and interrupt signal to facilitate communication between the chip and MCU and control the charging/discharging function. SY8809 integrates a communication port, which can realize high-speed communication from the MCU to the headset, and is very suitable for the design of charging bin – the high integration level greatly simplifies the peripheral circuits and components, providing a simple and easy-to-use solution for charging bin applications. The package format used by SY8809 is QFN4x4-24.
3R3 alloy power inductor peripheral to the power management chip.
Silk screen AN 1e IC.
Silk screen 02A09 IC.
The FPC is connected to the motherboard through the BTB connector.
The four LED indicators on the FPC are used to feedback remaining power information.
Pogo Pin connector for charging the earphones.
The earphones have a built-in lithium-ion battery and are protected by high-temperature insulating tape. Model: HT384448H, rated capacity: 1150mAh 4.43Wh, nominal voltage: 3.85V, charging limit voltage: 4.4V, from HT Technology.
Tear off the insulation protection and protect the circuit on one side of the battery board.
The circuit on the other side of the battery protection board.
Silk-printed 1P Ah integrated lithium battery protection IC, responsible for battery overcharge, overdischarge, and overcurrent protection.
PTC fuse for overcurrent protection.
02/ Oladance OWS Pro Earphones Teardown
To teardown the headphone part, first remove the sound cavity cover.
The inner structure of the cover, the inside of the sound hole and the tuning hole are covered with a layer of fine dust-proof net protection.
The speaker structure inside the cavity has an oval appearance.
Take out the speakers and pressure-sensitive touch buttons.
The internal structure of the sound cavity is equipped with a metal layer to isolate the speaker and back components.
Remove the back cover of the cavity. There is an FPC bluetooth antenna attached to the inside of the cover.
The mainboard structure inside the cavity is fixed by buckles.
Unhook all the connectors and take out the motherboard.
The internal structure of the cavity has a transparent bracket on the right bend to fix the microphone module – it is fixed and sealed by glue.
There is a pressure-sensitive touch sensor module on the inside of the pressure-sensitive touch key, which supports press and slide control.
Take out the pressure touch sensor module and the circuit on the other side. A BTB connector is provided on the FPC to connect to the motherboard.
Take out the microphone module.
There is also an FPC inside the cavity that connects to the battery at the end of the earhook.
High-precision laminated speaker front. According to the official introduction, it uses two diaphragms and two sets of magnetic circuits, which are assembled together with high precision, breaking through the limitations of the size of the speaker and achieving a doubling of the sound quality with twice the volume.
High-precision laminated speaker back.
The MEMS microphone of laser carving 2320 MX19 on the speaker FPC is used for call noise cancellation and focus mode function pickup.
The speaker FPC is connected to the BTB connector of the motherboard.
The circuit on one side of the microphone module.
The circuit on the other side of the microphone module.
The MEMS microphone of the Laser Engraving 2320 MX10 corresponds to the microphone pickup hole at the bottom of the cavity.
The MEMS microphone of Laser Engraving 2320 MX21 corresponds to the microphone pickup hole on the outside of the cavity.
The BTB connector that connects the microphone module to the motherboard.
The circuit on one side of the headphone motherboard.
The circuit on the other side of the headphone motherboard.
BES BES2600YP bluetooth audio SoC, bluetooth + noise cancellation + in-ear detection three-in-one single chip solution. It supports dual-mode Bluetooth 5.3 and multi-point connections, and integrates dual-core ARM STAR-MC1 CPU and ultra-low-power Sensor Hub subsystem, with powerful application processing capabilities. Supports open adaptive noise cancellation and AI noise cancellation. Supports assistive listening function and spatial audio. Support voice wake-up and interactive functions.
The crystal oscillator that provides the clock for the bluetooth chip.
Silk screen AJM 21S power amplifier chip.
AWINIC AW86862 pressure sensing IC has a size as small as 1.41mm × 1.41mm, which reduces the board area by 67% compared with the previous generation. It has the functions of pressure sensing signal collection, amplification and processing. Integrates an I²C communication module, a system control module, a power management module and an AFE module (including 2 analog input differential channels and multiplexers, 2-level PGA, 11-bit offset calibration DAC, 14 bit ADC and intelligent pressing logic processing module).
Pogo pin connector for bluetooth antenna.
LED indicator light for feedback of bluetooth pairing and charging status.
Silk screen B172 IC.
Connect the BTB connector of the speaker FPC.
BTB connector for pressure touch sensor.
Connect the BTB connector of the battery FPC.
Connect the BTB connector of the microphone module FPC.
AWINIC AW32001ACSR lithium battery charging IC with power path management – input withstand voltage 28V, supports 2-500mA charging current, parameters can be set by I2C interface.
Silk screen 1N 1e IC.
Remove the cover at the end of the earhook to find the battery and PCB board inside.
Remove the small board and the connector structure with the charging case.
The internal structure of the cavity, the circular structure is the power key cap.
BTB connector for connecting FPC to small board.
A cylindrical steel-shell battery is used inside the headphone.
The negative electrode of the battery is engraved with parameter information, model: MC78240A, nominal voltage: 3.82V, capacity: 150mAh, from MBT. MBT has a unique structural patent for this steel-cased cylindrical battery, and its energy density is more than 30% higher than that of soft-pack batteries of the same size.
Inside the connector structure connected to the charging case, there is a magnet in the middle that is fixed to the charging case.
The circuit on one side of the small board. Above is the silk-screened 3391M IC. In the middle is the micro button of the power switch.
The circuit on the other side of the small board is soldered to the battery and power input connector wires. On the right is the BTB connector for connecting to the FPC.
Silk-printed 3M VX integrated lithium battery protection IC.
All components of Oladance OWS Pro open-ear sports headphones.
Oladance OWS Pro charging case adopts the flat design, making it easy to carry. The matte coating feels delicate to the touch and is resistant to fingerprints and scratches. The headphones adopt the Möbius ergonomic design and are made of soft, skin-friendly silicone material, making them comfortable and stable to wear. The cavity cover adopts Oladance’s self-developed “ceramic skin”, which has a warm texture and pure color like ceramics.
The charging case has a built-in HT 1150mAh lithium battery and is equipped with a circuit protection board for charge and discharge protection. The motherboard adopts the TPS SY8809 charging bin solution – internally integrated charging module and discharging module, standard I2C interface and interrupt signal to facilitate communication between the chip and MCU – controlling charging and discharging functions. Cmsemicon CMS8S5887 microcontroller is used for the overall control of charging case.
The headphones are equipped with high-precision laminated diaphragm speakers and three built-in MEMS microphones for sound pickup. The main control chip is BES BES2600YP bluetooth audio SoC, which supports dual-mode Bluetooth 5.3 and multi-point connections, and has powerful application processing capabilities. AWINIC AW86862 pressure sensing IC and AW32001ACSR lithium battery charging IC are also used. The built-in battery capacity is 150mAh, which is an MBT steel-cased cylindrical battery – the energy density is more than 30% higher than that of soft-pack batteries of the same size.
PS: Translated from 52audio